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Beryllium Sputtering Targets

MSDS File
Material Type Beryllium
Symbol Be
Atomic Weight 9.0121831
Atomic Number 4
Color/Appearance White-gray Metallic
Thermal Conductivity 201 W/m.K
Melting Point (°C) 1278
Coefficient of Thermal Expansion 11.3 x 10-6/K
Theoretical Density (g/cc) 1.85
Z Ratio
Sputter RF, DC
UN Number 1567

Overview of Beryllium Sputtering Targets

Introduction to Beryllium Sputtering Targets

Beryllium, symbolized as Be, is a rare chemical element with atomic number 4. As an alkaline earth metal, it is typically found in minerals in combination with other elements. Beryllium is used in various applications, including as an inherent filter in X-ray tubes to determine X-ray energy. Beryllium is a steel-gray, lightweight, and brittle material that is often used for its unique properties in electronics, semiconductors, and flat-panel displays.

Key Properties of Beryllium Sputtering Targets

  • Material Type: Beryllium
  • Symbol: Be
  • Atomic Weight: 9.0122
  • Atomic Number: 4
  • Appearance: Steel-gray, strong, and brittle
  • Purity: 98.5% – 99.9%
  • Thermal Conductivity: 200 W/m.K
  • Density: 1.848 g/cc
  • Sputtering Method: PDC
  • Max Power Density: 80 W/in²
  • Bonding Options: Indium, Elastomer

Manufacturing Process

  1. Refining: Three-layer electrolytic process to ensure high purity.
  2. Melting and Casting: Semi-continuous casting using an electrical resistance furnace.
  3. Grain Refinement: Achieved through thermomechanical treatment for engineered microstructures.
  4. Final Packaging: Cleaned for vacuum use and protected from contaminants during shipping.

Product Specifications

  • Purity: 98.5% – 99.9%
  • Circular Dimensions: Up to 14-inch diameter, minimum 1 mm thickness.
  • Block Dimensions: Up to 32-inch length, 12-inch width, minimum 1 mm thickness.

Features and Benefits

  • High Purity: Ensures exceptional performance for high-precision applications.
  • Refined Grain Structure: Offers improved sputtering characteristics.
  • Competitive Pricing: Cost-effective for a variety of industries.
  • Semiconductor Grade: Suitable for semiconductor and advanced electronic applications.

Applications

Beryllium sputtering targets are used in:

  • Electronics
  • Semiconductor Manufacturing
  • Flat Panel Displays

Additional Options

  • 98.5% Minimum Purity
  • Smaller Sizes: Available for research and development applications.
  • Bonding Services: Indium and elastomer bonding for specialized requirements.

Inquiry Form

Required Information

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  • Email ID
  • Company Name
  • Industry

Optional Information

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  • Address
  • Country
  • Details About Material Requirements

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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