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VD0677 Bismuth Oxide Evaporation Materials, Bi2O3

Catalog No.VD0677
MaterialBismuth Oxide (Bi2O3)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a leading producer and supplier of high-purity bismuth oxide evaporation materials, along with a diverse range of other evaporation materials. We offer these materials in both powder and granule forms, and we can also provide customized solutions to meet specific needs upon request.

MSDS File

Bismuth Oxide Evaporation Materials Overview

TFM specializes in high-purity bismuth oxide evaporation materials, with the chemical formula Bi₂O₃. These oxide materials are critical for achieving high-quality films in deposition processes. Our bismuth oxide materials are produced with up to 99.9995% purity and are subject to rigorous quality assurance procedures to ensure their reliability.

Related Products: Bismuth Evaporation Materials

Applications of Bismuth Oxide Evaporation Materials

Bismuth oxide evaporation materials are used in:

  • Deposition Processes: Suitable for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applied in wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our bismuth oxide evaporation materials are carefully tagged and labeled to facilitate efficient identification and quality control. We ensure that the materials are protected from damage during storage and transportation.

Contact Us

TFM is a leading supplier of high-purity bismuth oxide evaporation materials, available in various forms including tablets, granules, rods, and wires. We also offer customized shapes and quantities upon request. Additionally, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and information on materials not listed, please contact us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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