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ST0235 Cadmium Fluoride Sputtering Target, CdF2

Chemical Formula: CdF2
Catalog Number: ST0235
CAS Number: 7790-79-6
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Cadmium Fluoride  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Cadmium Fluoride Sputtering Target Description

Cadmium fluoride sputtering target from TFM is a fluoride ceramic sputtering material with the chemical formula CdF2. This material is used in various applications, including thin film deposition and optical coatings.

CadmiumCadmium is a chemical element that originates from the Latin word ‘cadmia,’ the name for the mineral calmine. It was first identified in 1817 by S. L Hermann, F. Stromeyer, and J.C.H. Roloff, who also successfully isolated the element. The chemical symbol for cadmium is “Cd.” It is located at atomic number 48 in the periodic table, within Period 5 and Group 12, belonging to the d-block. The relative atomic mass of cadmium is 112.411(8) Dalton, where the number in brackets indicates the measurement uncertainty.

Related Product: Cadmium Sputtering Target

FluorineFluorine, also known as fluorin, is a chemical element derived from the Latin word ‘fluere,’ which means “to flow.” It was first mentioned in 1810 and observed by A.-M. Ampère, with its isolation later achieved and announced by H. Moissan. The chemical symbol for fluorine is “F.” It occupies atomic number 9 in the periodic table, situated in Period 2 and Group 17, within the p-block. The relative atomic mass of fluorine is 18.9984032(5) Dalton, with the number in brackets indicating the uncertainty in this measurement.

Cadmium Fluoride Sputtering Target Specification

Compound FormulaCdF2
Molecular Weight150.41
AppearanceWhite
Melting Point1,110° C
Boiling Point1,748° C
Density6.33 g/cm3

Cadmium Fluoride Sputtering Target Packaging

Our cadmium fluoride sputtering target is meticulously tagged and labeled on the exterior to ensure easy identification and maintain quality control standards. We take exceptional care in handling and packaging these targets to prevent any potential damage during storage or transportation, ensuring that they arrive in optimal condition.

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TFM offers Cadmium Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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