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ST0007A Calcium Phosphate Sputtering Targets

Material TypeCalcium Phosphate
SymbolCa3(PO4)2
Color/AppearanceWhite solid
Melting Point (°C)
Density
Molecular Weight
Sputter
Exact Mass

Calcium Phosphate Sputtering Targets

Calcium Phosphate (Ca₃(PO₄)₂) sputtering targets are high-purity materials used in the deposition of thin films for a variety of applications across industries such as electronics, biomedical devices, and materials science. Calcium Phosphate is renowned for its biocompatibility and its excellent properties for use in coatings and thin films that require stability and durability.

Specifications

  • Purity: 99.9%

  • Circular Targets: Diameter ≤ 14 inches, Thickness ≥ 1mm

  • Block Targets: Length ≤ 32 inches, Width ≤ 12 inches, Thickness ≥ 1mm

Key Features and Advantages

  • High Purity: TFM’s Calcium Phosphate sputtering targets are manufactured with a purity of 99.9%, ensuring high-quality thin films with excellent consistency and performance.

  • Custom Sizes Available: These targets are offered in custom sizes to accommodate specific requirements for both research and development (R&D) and large-scale industrial applications.

  • Biocompatibility: Calcium Phosphate is known for its biocompatibility, making it a perfect material for biomedical applications, especially in coatings for implants and other medical devices.

  • Durability: Calcium Phosphate thin films offer excellent mechanical properties, including high hardness and chemical stability, which makes them ideal for coatings that need to withstand harsh environments.

  • Vacuum Compatibility: These targets are designed to work seamlessly in vacuum deposition systems, ensuring high-efficiency and high-quality thin film production.

Applications

  • Biomedical Coatings: Calcium Phosphate is widely used in the biomedical field for implant coatings, prosthetics, and bone tissue engineering. Its excellent biocompatibility ensures safe use in the human body.

  • Semiconductor and Electronics: The material can be used in electronic devices that require high dielectric properties and stability, such as capacitors, resistors, and other thin-film components.

  • Optical Coatings: Calcium Phosphate films are used in optical coatings, particularly for devices requiring stable and durable coatings that resist wear and corrosion.

  • Materials Science: As a material for thin-film deposition, Calcium Phosphate is employed in research and development of novel materials for high-performance coatings and other material applications.

  • Energy Storage: With its stability, Calcium Phosphate can be used in energy storage applications where high chemical and mechanical durability is required, particularly in batteries and capacitors.

Manufacturing Process

  • Cold-Pressed and Sintered: The Calcium Phosphate sputtering targets are produced through cold pressing and sintering techniques to ensure high density, uniformity, and excellent sputtering performance.

  • Elastomer Bonding: TFM’s Calcium Phosphate targets are elastomer bonded to the backing plate, ensuring reliable performance and minimizing mechanical stress during the sputtering process.

  • Cleaning and Packaging: The targets are thoroughly cleaned to remove any contaminants and are carefully packaged to protect from damage or environmental contamination during transport and storage.

Available Options

  • 99.9% Purity: TFM’s Calcium Phosphate sputtering targets are available with a 99.9% purity, ensuring that thin films produced from these targets will have excellent properties and consistency.

  • Custom Sizes: Custom-sized targets are available for specific application needs, whether for industrial production or research and development purposes.

  • R&D Applications: Smaller-sized targets are available for research and development (R&D), allowing for prototyping and experimentation in various scientific fields.

  • Sputtering Target Bonding Service: TFM offers a sputtering target bonding service, ensuring the target is securely attached to the backing plate, enhancing performance during the sputtering process.

Conclusion

TFM’s Calcium Phosphate Sputtering Targets offer an ideal solution for applications requiring high-purity, durable, and biocompatible thin films. With their use in a range of industries, from biomedical to electronics and materials science, these sputtering targets ensure high-quality film deposition for both research and industrial needs. With custom sizes, 99.9% purity, and vacuum compatibility, Calcium Phosphate sputtering targets from TFM provide reliable and consistent performance for cutting-edge applications.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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