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ST0007 Calcium Sputtering Target, Ca

Chemical Formula: Ca
Catalog Number: ST0007
CAS Number: 7440-70-2
Purity: 99%, 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Calcium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

 

MSDS File

Availability: 1 in stock

Calcium Sputtering Target Description

CalciumCalcium sputtering targets share the properties of metallic calcium. Calcium is primarily used as a reducing agent in metal production. In iron and steel production, it helps remove oxygen, sulfur, and carbon. It is also used in small amounts in copper and beryllium alloys. Various calcium compounds are used in food, pharmaceuticals, cosmetics, and dietary supplements to enhance bone and dental health. Calcium is available in purities ranging from 99% to 99.999%. Oxides and fluorides of calcium are insoluble and used in metallurgy, vapor deposition, and optical coatings. Soluble forms include chlorides, nitrates, and acetates, which can be manufactured as solutions with specific stoichiometries.

Calcium Sputtering Target Specification

Atomic Weight40.078
Atomic Number20
Color/AppearanceSilvery White, Metallic
Thermal Conductivity200 W/m.K
Melting Point839 °C
Coefficient of Thermal Expansion22.3 x 10-6/K
Theoretical Density1.54 g/cc
Z Ratio2.62
Max Power Density*20 Watts/Square Inch
UN Number1401
CommentsCorrodes in air.
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Calcium Sputtering Target Applications

Calcium sputtering targets are used for:

  • Deoxidizing, desulfurizing, and decarburizing ferrous and nonferrous alloys
  • Alloying with aluminum, beryllium, copper, lead, and magnesium
  • Applications in the food, pharmaceutical, and medical industries

Handling Notes of Calcium Sputtering Target

  • Bonding services for calcium sputter targets are currently unavailable.
  • Due to its high chemical reactivity, calcium targets require oil packaging and thorough cleaning to prevent reactions with the environment.

Get Contact

TFM offers Calcium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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