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Lithium Oxide Sputtering Targets

ST0958 Calcium Vanadium Oxide Sputtering Target, CaVO3

Chemical Formula CaVO3
Catalog No. ST0958
CAS Number 14100-64-2
Purity 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape Discs, Plates, Column Targets, Step Targets, Custom-made

The Calcium Vanadium Oxide Sputtering Target stands as a benchmark in thin film deposition technology, ensuring both precision and durability. Expertly crafted for high-performance coating processes, this target is designed to deliver superior results. Its exceptional quality makes it an ideal choice for advanced applications in the electronics and semiconductor industries. Elevate your deposition processes with the Calcium Vanadium Oxide Sputtering Target—reliable, cutting-edge technology that meets the highest standards.

MSDS File

Calcium Vanadium Oxide Sputtering Target Description

TFM offers high-purity Calcium Vanadium Oxide sputtering targets, designed for use in advanced thin film deposition processes, particularly in solid-state battery research, electrochromic devices, and functional oxide coatings. These ceramic targets are engineered to deliver uniform films with excellent stoichiometric control during sputtering.

Calcium Vanadium Oxide (CaVO₃) is a perovskite-type oxide material that exhibits intriguing electronic, ionic, and catalytic properties. It is widely studied for applications such as:

  • Thin-film solid oxide fuel cells (SOFCs)

  • Lithium-ion battery electrodes

  • Memristive switching and neuromorphic computing devices

  • Transparent conductive oxides (TCOs)

The unique interaction between calcium and vanadium in the CaVO₃ lattice makes this material an attractive candidate for next-generation electronic devices and energy storage solutions.

Calcium Vanadium Oxide Sputtering Target Specification

Property Value
Compound Formula CaVO₃ (Calcium Vanadium Oxide)
Purity ≥ 99.9% (3N)
Appearance Black or dark gray ceramic target
Crystal Structure Orthorhombic perovskite
Density ~5.2 g/cm³
Melting Point Decomposes before melting
Available Sizes Dia.: 1″, 2″, 3″, 4″
Thick: 0.125″, 0.250″ (custom sizes on request)
Form Sintered ceramic target (bonded or unbonded)

Calcium Vanadium Oxide Sputtering Target Handling Notes

  1. Bonding is recommended due to the material’s ceramic nature and brittleness.

  2. Avoid rapid heating or cooling to minimize thermal shock and cracking.

  3. Store in a dry, inert atmosphere to prevent surface degradation.

Calcium Vanadium Oxide Sputtering Target Packaging

Each Calcium Vanadium Oxide sputtering target from TFM is packaged with extreme care, sealed under vacuum or argon, and cushioned in protective foam or plastic casing. Labels include full material ID, batch number, and purity level to ensure traceability and quality assurance.

Get Contact

TFM supplies Calcium Vanadium Oxide sputtering targets in a variety of sizes and custom specifications for research and production use. Our targets are suitable for pulsed laser deposition (PLD), RF magnetron sputtering, and other physical vapor deposition (PVD) methods.
Contact us today to request a quote or discuss application-specific requirements.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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