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ST0239 Chromium Fluoride Sputtering Target, CrF3

Chemical Formula: CrF3
Catalog Number: ST0239
CAS Number: 7788-97-8
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Chromium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Chromium Fluoride Sputtering Target (CrF₃) is a specialized deposition material used in thin-film fabrication processes such as magnetron sputtering and other physical vapor deposition (PVD) techniques. Chromium fluorides attract significant interest in advanced coating technologies due to their unique chemical stability, fluorine-rich composition, and ability to form protective, functional thin films.

CrF₃ sputtering targets are commonly used in research laboratories and industrial coating systems where fluorinated coatings with specific optical, chemical, or surface properties are required. These coatings are particularly valuable in semiconductor manufacturing, optical film production, corrosion-resistant surfaces, and specialized electronic devices.

Detailed Description

Chromium Fluoride (CrF₃) sputtering targets are typically manufactured from high-purity chromium fluoride compounds that are carefully processed to achieve the density, microstructure, and mechanical stability required for sputtering systems. The compound CrF₃ contains chromium in the +3 oxidation state combined with fluorine atoms, forming a stable ionic crystal structure that can withstand the energetic environment inside sputtering chambers.

The production of CrF₃ sputtering targets usually involves advanced powder processing techniques such as hot pressing, cold isostatic pressing (CIP), or sintering under controlled atmospheres. These processes ensure high density and uniform grain distribution, which are critical for achieving consistent sputtering rates and uniform film deposition.

Due to the presence of fluorine, chromium fluoride targets are capable of producing fluorine-containing thin films that exhibit unique chemical and surface characteristics. These films may provide improved corrosion resistance, lower surface energy, enhanced chemical stability, and specialized optical behavior. In some deposition systems, CrF₃ targets are also used as precursors for forming chromium-based fluoride layers or mixed oxide-fluoride coatings.

For vacuum coating systems, chromium fluoride sputtering targets can be supplied in various geometries, including circular planar targets, rectangular targets, or bonded targets with copper or titanium backing plates. Bonded assemblies improve heat dissipation during sputtering, enabling higher power operation and longer target life.

High-purity CrF₃ targets also help reduce contamination in deposited films, which is particularly important for semiconductor fabrication and optical applications where even trace impurities may affect device performance.

Applications

Chromium Fluoride Sputtering Targets are used in several advanced thin-film technologies, including:

  • Optical coatings – Fluoride-based layers for antireflective coatings, infrared optics, and optical filters.

  • Semiconductor fabrication – Functional thin films for microelectronic devices and research materials.

  • Surface protection coatings – Chemical-resistant coatings for aggressive environments.

  • Specialized electronic materials – Fluoride thin films for dielectric or insulating layers.

  • Research and development – Material science studies involving fluorinated thin films and compound coatings.

  • Vacuum deposition experiments – Thin film growth for laboratory-scale studies in PVD systems.

These coatings are particularly attractive in applications requiring low refractive index films, chemical inertness, or unique surface chemistry.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Higher purity improves thin film consistency and reduces contamination
Density≥ 95% of theoreticalEnsures stable sputtering performance
Diameter25 – 300 mm (custom)Compatible with various sputtering systems
Thickness3 – 6 mmInfluences target life and sputtering rate
Backing PlateCopper / Titanium bonding availableImproves thermal conductivity and mechanical stability
Grain StructureFine and uniformSupports stable plasma and uniform deposition

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Chromium Fluoride (CrF₃)Fluorine-rich films with strong chemical resistanceOptical coatings, protective films
Chromium Oxide (Cr₂O₃)Hard and wear-resistant oxide coatingsProtective and decorative coatings
Magnesium Fluoride (MgF₂)Extremely low refractive indexOptical antireflection coatings
Aluminum Fluoride (AlF₃)High transparency in UV rangeOptical thin films

FAQ

QuestionAnswer
Can the Chromium Fluoride Sputtering Target be customized?Yes, diameter, thickness, purity, and bonding configuration can all be customized according to the sputtering system requirements.
Is a backing plate necessary?For high-power sputtering systems, copper or titanium backing plates are recommended to improve heat dissipation and prevent cracking.
What deposition methods are compatible with CrF₃ targets?Magnetron sputtering, RF sputtering, and other physical vapor deposition methods are commonly used.
Are fluorine-containing films stable?Yes, fluoride films typically exhibit strong chemical stability and corrosion resistance in many environments.
What industries commonly use this material?Semiconductor manufacturing, optical coating industries, materials research laboratories, and advanced electronics sectors.

Packaging

Our Chromium Fluoride Sputtering Target are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Chromium Fluoride Sputtering Targets provide a reliable source material for depositing fluorine-containing thin films with excellent chemical stability and functional properties. Their compatibility with advanced sputtering systems and ability to produce specialized coatings make them valuable in semiconductor fabrication, optical coatings, and research environments.

With customizable dimensions, high purity options, and bonding configurations, CrF₃ sputtering targets can be tailored to meet the precise requirements of modern vacuum deposition systems.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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