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ST0239 Chromium Fluoride Sputtering Target, CrF3

Chemical Formula: CrF3
Catalog Number: ST0239
CAS Number: 7788-97-8
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Chromium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Chromium Fluoride Sputtering Target Description

Chromium fluoride sputtering target is a fluoride ceramic material composed of chromium (Cr) and fluorine (F). It is commonly used in thin film deposition processes across various industries, including semiconductors, displays, and optical coatings, due to its desirable properties like high resistance to corrosion and oxidation.

ChromiumChromium is a chemical element with the symbol “Cr” and atomic number 24. The name “chromium” is derived from the Greek word ‘chroma,’ meaning color, due to the various colorful compounds it forms. Chromium was discovered in ancient times, notably being used in the creation of the Terracotta Army’s weapons. It is a d-block element located in Period 4 and Group 6 of the periodic table. The relative atomic mass of chromium is 51.9961(6) Dalton, with the number in brackets indicating the uncertainty.

Related Product: Chromium Sputtering Target

Fluorine

Fluorine, represented by the symbol “F,” is a chemical element with atomic number 9. Its name comes from the Latin word ‘fluere,’ meaning “to flow,” reflecting its role in fluorite’s use as a flux in smelting. Fluorine was first identified in 1810 by A.-M. Ampère, and its isolation was successfully achieved by H. Moissan. It is located in Period 2 and Group 17 of the periodic table, within the p-block. The relative atomic mass of fluorine is 18.9984032(5) Dalton, with the number in parentheses indicating the uncertainty in the measurement.

Chromium Fluoride Sputtering Target Application

The chromium fluoride sputtering target is employed in a variety of applications including thin film deposition for semiconductors, displays, LEDs, and photovoltaic devices. It’s also used for decorative coatings, functional coatings in optical information storage industries, and glass coatings, such as those used in automotive and architectural glass. Additionally, this material is valuable in optical communication systems, providing durable and effective coatings that enhance performance and longevity.

Chromium Fluoride Sputtering Target Packing

Our chromium fluoride sputter targets are carefully tagged and labeled externally to ensure efficient identification and maintain quality control. We take great care during storage and transportation to prevent any damage, ensuring the products arrive in optimal condition.

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TFM offers Chromium Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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