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ST0210 Chromium Nitride Sputtering Target, Cr2N

Chemical Formula: Cr2N
Catalog Number: ST0210
CAS Number: 12053-27-9
Purity: 99.5%, 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Chromium Nitride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Chromium Nitride Sputtering Target Description

Chromium Nitride (Cr2N) sputtering target, provided by TFM, is a high-quality nitride ceramic material. This material is commonly used in various industrial applications, including coatings for corrosion resistance, wear resistance, and enhanced hardness. It is also employed in the semiconductor industry and for decorative coatings.

ChromiumChromium, represented by the symbol “Cr,” is a chemical element with the atomic number 24. The name originates from the Greek word ‘chroma,’ meaning color, reflecting the many colorful compounds it forms. Chromium has been known and used since ancient times, with historical references dating back to the Terracotta Army era. Positioned in Period 4 and Group 6 of the periodic table, it belongs to the d-block. The relative atomic mass of chromium is 51.9961(6) Dalton, indicating the measurement’s precision.

Related Product: Chromium Sputtering Target

NitrogenNitrogen, symbolized as “N,” is a chemical element with the atomic number 7. The name comes from the Greek words ‘nitron’ and ‘genes,’ which mean nitre-forming. It was first identified in 1772 by Daniel Rutherford, who also managed to isolate it. Positioned in Period 2 and Group 15 of the periodic table, nitrogen belongs to the p-block elements. The relative atomic mass of nitrogen is 14.0067(2) Dalton, with the number in brackets representing the uncertainty in this value.

Chromium Nitride Sputtering Target Packaging

Our chromium nitride sputter targets are meticulously handled and packaged to ensure their integrity and quality. We take great care in preventing any potential damage during storage and transportation, thereby preserving the original condition of our products. Each target is clearly tagged and labeled for efficient identification and quality control, ensuring that they arrive in perfect condition for our customers.

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TFM offers Chromium Nitride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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