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ST0492 Cobalt Niobium Zirconium Sputtering Target, Co/Nb/Zr

Chemical Formula: Co/Nb/Zr
Catalog Number: ST0492
Purity: 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Cobalt Niobium Zirconium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

 

MSDS File

Cobalt Niobium Zirconium Sputtering Target Description

cobalt

Cobalt is a chemical element named after the German word *kobald*, meaning “goblin.” It was first mentioned in 1732 and observed by G. Brandt. The chemical symbol for cobalt is “Co.” Cobalt is widely used as a blue pigment in paints, jewelry, and glass. It is also commonly alloyed with other metals to produce engine parts and cutting tools. In vacuum applications, cobalt serves as a ferromagnetic layer in magnetic storage media and as a transitional layer in battery fabrication.

niobiumNiobium is a silver-colored metal typically found alongside tantalum, with the two elements being separated through fractional crystallization of their fluoro-complexes. It has an abundance of 20 ppm in the Earth’s crust. As a pure metal, niobium is highly reactive and forms a very stable oxide when exposed to air, which enhances its corrosion resistance. At elevated temperatures, niobium can react with various non-metals.

ZirconiumZirconium is a lustrous, grey-white transition metal that closely resembles hafnium and, to a lesser extent, titanium. It is primarily used as a refractory and opacifier, with smaller amounts utilized as an alloying agent due to its strong corrosion resistance. Zirconium forms various inorganic and organometallic compounds, such as zirconium dioxide and zirconocene dichloride. It has five naturally occurring isotopes, three of which are stable. Zirconium compounds do not have any known biological role.

Related Products: Cobalt Sputtering Target, Niobium Sputtering Target, Zirconium Sputtering Target.

Cobalt Niobium Zirconium Sputtering Target Specifications

Material Type Cobalt Niobium Zirconium
Symbol Co/Nb/Zr
Color/Appearance Metallic solid in various forms including powder, sputtering target, foil, bar, plate
Melting Point /
Density /
Available Sizes Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Packing

Our Cobalt Niobium Zirconium Sputtering Targets are clearly tagged and labeled for efficient identification and quality control. We ensure that great care is taken to prevent any damage during storage and transportation, maintaining the targets in excellent condition.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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