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VD0681 Cobalt(II) Oxide Evaporation Materials, CoO

Catalog No.VD0681
MaterialCobalt Oxide (CoO)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made
Thin-Film Mat Engineering (TFM) is a premier manufacturer and supplier of high-purity cobalt(II) oxide evaporation materials, along with a diverse range of other evaporation materials. We provide these materials in both powder and granule forms, with options for custom shapes available upon request.
MSDS File

Cobalt(II) Oxide Evaporation Materials Overview

Thin-Film Mat Engineering (TFM) provides high-purity cobalt(II) oxide evaporation materials with the chemical formula CoO. This material is essential for achieving high-quality films in deposition processes. TFM ensures exceptional reliability by producing cobalt(II) oxide with purities up to 99.9995%, thanks to our rigorous quality assurance practices.

Related Products: Cobalt Evaporation Materials

Specifications

Material TypeCobalt(II) Oxide
Form Evaporation Materials
SymbolCoO
Color/AppearanceGray
Melting Point1,933 °C
Density 6.45 g/cm3
Purity 99.5% ~ 99.99%
Shape Powder/ Granule/ Custom-made

Applications

Cobalt(II) oxide evaporation materials are used in:

  • Deposition processes, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD)
  • Optics applications, such as wear protection, decorative coatings, and displays

Packaging

Our cobalt(II) oxide evaporation materials are carefully tagged and labeled for accurate identification and quality control. We take extensive precautions to prevent any damage during storage and transportation.

Contact Us

TFM is a leading provider of high-purity cobalt(II) oxide evaporation materials, available in various forms including tablets, granules, rods, and wires. Custom shapes and quantities can be arranged upon request. We also offer evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and additional information, please send us an inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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