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Cobalt Platinum Sputtering Target

ST0904 Cobalt Platinum Sputtering Target, Co/Pt

Chemical FormulaCo/Pt
Catalog No.ST0904
CAS NumberN/A
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Cobalt Platinum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Cobalt Platinum Sputtering Target Description

Cobalt Platinum Sputtering Target is a specialized material used in sputter deposition, a technique for creating thin films. In this process, ions bombard the target material, causing atoms to be ejected and deposited onto a substrate, forming a thin film.

Cobalt and platinum, the metals used in this target, each bring distinct advantages to specific applications. Platinum is renowned for its corrosion resistance and catalytic properties, while cobalt is valued for its magnetic capabilities.

Related Product: Aluminum Cobalt Sputtering Target, Chromium Cobalt Sputtering Target

Cobalt Platinum Sputtering Target Specifications

Compound FormulaCo/Pt
Molecular Weight254.02
AppearanceMetallic solid
Melting Point1680-1770℃
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Cobalt Platinum Sputtering Target Application

Cobalt Platinum Sputtering Target is widely utilized in the production of electronic devices, including semiconductors, solar cells, and flat-panel displays.

Cobalt Platinum Sputtering Target Packaging

Our Cobalt Platinum Sputtering Targets are meticulously handled throughout storage and transportation to maintain their quality in pristine condition.

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TFM offers Cobalt Platinum Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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