Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
copper-aluminum-evaporation-materials

VD0618 Copper Aluminum Evaporation Materials, Cu/Al

Catalog No.VD0618
MaterialCopper Aluminum (Cu/Al)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM excels in the production of high-purity copper aluminum evaporation materials, ensuring exceptional quality and reliability through rigorous quality assurance processes. We offer these materials in a variety of forms, including tablets, granules, pellets, and powders, to meet diverse application needs. Our commitment to quality and precision guarantees that our products consistently perform at the highest standards.

MSDS File

Copper Aluminum Evaporation Materials Overview

TFM provides high-purity copper aluminum evaporation materials, consisting of a precise alloy of copper (Cu) and aluminum (Al). Our materials are crafted to achieve up to 99.9995% purity, crucial for high-quality film deposition in various applications. We employ stringent quality assurance processes to ensure the reliability and performance of our products.

Applications of Copper Aluminum Evaporation Materials

Our copper aluminum evaporation materials are versatile and used in multiple deposition processes, including:

  • Semiconductor Deposition: Essential for the creation of thin films in semiconductor manufacturing.
  • Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD): Key to producing high-quality coatings in various industrial applications.
  • Optics: Applied in wear protection, decorative coatings, and display technologies.

Packaging and Handling

We take great care in packaging our copper aluminum evaporation materials to avoid damage during storage and transportation, ensuring they arrive in optimal condition.

Contact Us

TFM stands out as a premier provider of high-purity copper aluminum evaporation materials. We offer these materials in various forms, including powders and granules, with customization options available upon request. For current pricing or to inquire about materials not listed, please contact us directly.

Reviews

There are no reviews yet.

Be the first to review “VD0618 Copper Aluminum Evaporation Materials, Cu/Al”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

Shopping Cart
Scroll to Top