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Copper Aluminum Sputtering Target

ST0083 Copper Aluminum Sputtering Target, Cu/Al

Chemical Formula: Cu/Al
Catalog Number: ST0083
CAS Number: 7440-50-8 | 7429
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Copper Aluminum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Copper Aluminum Sputtering Target

Introduction

The Copper Aluminum Sputtering Target is a widely used alloy material designed for thin film deposition in semiconductor, optical, and decorative coating industries. By combining the high conductivity of copper with the lightweight, corrosion-resistant properties of aluminum, this sputtering target delivers excellent balance between electrical, thermal, and mechanical performance, making it suitable for diverse PVD applications.

Detailed Description

Copper Aluminum sputtering targets are typically manufactured using high-purity raw materials under advanced melting and powder metallurgy processes, followed by hot pressing or vacuum melting to ensure density and uniformity.

  • Composition: Alloy ratios can be tailored, with common formulations such as Cu:Al = 90:10 (wt%) or other custom compositions depending on application.

  • Purity: High-purity alloy (≥99.9%) ensures reduced contamination and stable thin film performance.

  • Microstructure: Fine-grained, dense targets support uniform sputtering rates and improved thin film adhesion.

  • Dimensions: Available in disc, rectangular, and custom shapes with diameters from 25 mm to 300 mm and thicknesses of 3–6 mm.

  • Bonding Options: Indium, elastomer, or high-conductivity backing plates (copper/titanium) are available for efficient heat transfer and longer target life.

Applications

Copper Aluminum Sputtering Targets are utilized across industries:

  • Semiconductors & Electronics – Interconnect layers, contact coatings, conductive films.

  • Optical Coatings – Reflective and anti-reflective coatings in lenses and displays.

  • Energy Devices – Thin films for solar cells and advanced energy storage systems.

  • Decorative Coatings – Durable, aesthetically appealing coatings in consumer products.

  • R&D – Thin film studies in universities, labs, and high-tech companies.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity≥ 99.9%Ensures stable film quality and reduced defects
Diameter25 – 300 mm (custom)Compatible with most sputtering systems
Thickness3 – 6 mmInfluences deposition efficiency
BondingCopper / Titanium backingImproves heat conduction & mechanical stability
Alloy Ratio (Cu:Al)90:10 or customTailored to optimize electrical/thermal properties

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Copper Aluminum Alloy TargetGood balance of conductivity & strengthSemiconductor, optical coatings
Pure Copper TargetExcellent conductivity, low resistivityMicroelectronics, wiring films
Pure Aluminum TargetLightweight, corrosion resistanceOptical & decorative coatings

FAQ

QuestionAnswer
Can the Cu:Al ratio be customized?Yes, alloy composition can be tailored to meet specific requirements.
What is the standard lead time?Typically 2–3 weeks depending on size and customization.
Is backing plate bonding available?Yes, indium or elastomer bonding with Cu/Ti plates is standard.
How is it packaged?Vacuum-sealed and shipped in protective foam-lined export-safe cartons or crates.
Which industries use it most?Semiconductor, optics, decorative coatings, and solar energy.

Packaging

Every Copper Aluminum Sputtering Target is vacuum-sealed to prevent contamination, then packed with shock-absorbing foam in export-safe cartons or wooden crates. External labeling ensures clear identification and traceability throughout storage and transport.

Conclusion

Copper Aluminum Sputtering Targets combine conductivity, durability, and versatility, making them a preferred choice in thin film deposition across multiple industries. With customizable purity, size, bonding, and alloy ratios, they provide reliable solutions for both industrial-scale production and advanced research.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com]

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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