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ST0892 Copper Indium Gallium Sputtering Target, Cu/In/Ga

Chemical FormulaCu/In/Ga
Catalog No.ST0892
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Copper Indium Gallium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Copper Indium Gallium Sputtering Target Description

The Copper Indium Gallium Sputtering Target is employed in thin film deposition processes, made from a blend of copper (Cu), indium (In), and gallium (Ga). In sputtering, material is ejected from the target surface and deposited onto a substrate to create a thin film.

This target is primarily used in the production of Copper Indium Gallium Selenide (CIGS) solar cells. These thin-film photovoltaic devices are known for their high efficiency and flexibility, making them ideal for applications like building-integrated photovoltaics.

Copper Indium Gallium Sputtering Target Specifications

Compound FormulaCu/In/Ga
AppearanceMetallic target
Molecular Weight248.087
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Copper Indium Gallium Sputtering Target Handling Notes

Indium bonding is recommended for the Copper Indium Gallium Sputtering Target due to its characteristics that can pose challenges during sputtering, such as brittleness and low thermal conductivity. The material’s low thermal conductivity makes it susceptible to thermal shock, so indium bonding helps improve its performance and stability during the sputtering process.

Copper Indium Gallium Sputtering Target Application

The Copper Indium Gallium Sputtering Target is essential for manufacturing Copper Indium Gallium Selenide (CIGS) solar cells, which are thin-film photovoltaic devices. CIGS solar cells are known for their high efficiency and flexibility, making them ideal for diverse applications, including building-integrated photovoltaics.

Copper Indium Gallium Sputtering Target Packaging

We take great care in handling our Copper Indium Gallium Sputtering Targets during storage and transportation to ensure they maintain their quality and remain in their original condition.

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TFM offers Copper Indium Gallium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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