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Copper Zinc Sputtering Target

ST0090 Copper Zinc Sputtering Target, Cu/Zn

Chemical Formula: Cu/Zn
Catalog Number: ST0090
CAS Number: 7440-50-8 | 7440
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Copper Zinc sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Copper Zinc (Cu/Zn) Sputtering Target—commonly associated with brass-type alloys—is widely used for depositing conductive, decorative, and functional alloy thin films. By combining copper’s excellent electrical conductivity with zinc’s corrosion resistance and color control, Cu/Zn sputtering targets enable fine tuning of film properties across electronics, optics, and surface engineering applications. Their versatility makes them a practical choice for both R&D and industrial-scale coating processes.

Detailed Description

Our Copper Zinc Sputtering Targets are produced from carefully alloyed Cu/Zn materials with tightly controlled composition to ensure uniform sputtering behavior and consistent film chemistry. The Cu-to-Zn ratio can be adjusted to meet specific electrical, mechanical, or aesthetic requirements, which is particularly important for applications where film resistivity, adhesion, or color tone must be precisely controlled.

Manufacturing involves high-purity raw materials, vacuum melting or powder metallurgy routes (depending on specification), and precision machining to achieve excellent dimensional accuracy and surface finish. The dense, homogeneous microstructure minimizes arcing and particle generation during sputtering, contributing to stable plasma conditions and reproducible deposition rates. Targets can be supplied unbonded or bonded to copper or titanium backing plates to improve heat dissipation and mechanical stability in higher-power sputtering systems.

Applications

Copper Zinc Sputtering Targets are used across a broad range of thin film technologies, including:

  • Decorative coatings with controlled gold-like or bronze color tones

  • Conductive and semi-conductive alloy films in microelectronics

  • Wear-resistant and corrosion-resistant surface coatings

  • Architectural and automotive glass coatings

  • Optical and functional multilayer thin film stacks

  • Research and development of Cu-based alloy films

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionCu/Zn alloy (custom ratios)Controls conductivity, color, and corrosion resistance
Purity99.9% – 99.99%Ensures stable sputtering and film quality
Diameter25 – 300 mm (custom available)Fits standard sputtering cathodes
Thickness3 – 10 mmAffects target lifetime and deposition rate
Density≥ 99% theoreticalImproves plasma stability
BondingUnbonded / Cu or Ti backingEnhances thermal management

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Cu/ZnBalanced conductivity and corrosion resistanceDecorative & functional coatings
Pure CopperExcellent electrical conductivityInterconnects, conductive layers
Pure ZincStrong corrosion protectionProtective coatings
Copper Tin (Cu/Sn)Higher hardnessWear-resistant films

FAQ

QuestionAnswer
Can the Cu/Zn ratio be customized?Yes, alloy composition can be tailored to your application requirements.
Is DC sputtering suitable for Cu/Zn targets?Yes, Cu/Zn targets are conductive and compatible with DC sputtering systems.
Are bonded targets available?Yes, bonding to copper or titanium backing plates is available upon request.
How are the targets packaged for shipment?Vacuum-sealed with protective foam and export-grade cartons or wooden crates.

Packaging

Our Copper Zinc Sputtering Targets are carefully tagged and externally labeled to ensure easy identification and strict quality control. Each target is vacuum-packed and protected to prevent oxidation, contamination, or mechanical damage during storage and transportation.

Conclusion

Copper Zinc (Cu/Zn) Sputtering Target provides a reliable and flexible solution for depositing alloy thin films with tunable electrical, mechanical, and decorative properties. With precise composition control, high density, and customizable dimensions and bonding options, it is well suited for both industrial coating lines and advanced research applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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