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dysprosiumiii-oxide

VD0684 Dysprosium(III) Oxide Evaporation Materials, Dy2O3

Catalog No.VD0684
MaterialDysprosium Oxide (Dy2O3)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity dysprosium(III) oxide evaporation materials, along with a broad range of other evaporation materials. We provide our products in both powder and granule forms, with customized options available to meet specific requirements.

MSDS File

Dysprosium(III) Oxide Evaporation Materials Overview

TFM provides high-purity dysprosium(III) oxide evaporation materials, with the chemical formula Dy₂O₃. These materials are crucial for achieving high-quality films in various deposition processes. Our dysprosium(III) oxide evaporation materials are available with up to 99.9995% purity, reflecting our stringent quality assurance measures.

Specifications

Material Type Dysprosium(III) Oxide
Form Evaporation Materials
Symbol Dy2O3
Color/Appearance Pastel yellowish-greenish
Melting Point  2,408 °C
Density 7.80 g/cm3
Purity 99.5% ~ 99.99%
Shape Powder/ Granule/ Custom-made

Applications

Dysprosium(III) oxide evaporation materials are utilized in various applications, including:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Uses: Suitable for wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

Our dysprosium(III) oxide evaporation materials are carefully tagged and labeled to ensure easy identification and maintain high quality. We take great care to prevent damage during storage and transportation.

Contact Us

TFM is your go-to source for high-purity dysprosium(III) oxide evaporation materials. We offer these materials in multiple forms, including tablets, granules, rods, and wires. Custom shapes and quantities are available upon request. Additionally, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or information on additional products, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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