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Dysprosium Sputtering Target

ST0012 Dysprosium Sputtering Target, Dy

Chemical Formula: Dy
Catalog Number: ST0012
CAS Number: 7429-91-6
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Dysprosium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Dysprosium (Dy) Sputtering Target is a high-purity rare earth metal material widely used in magnetic, optical, and advanced electronic thin film applications. Known for its strong magnetic moment and high neutron absorption cross-section, dysprosium plays a critical role in functional coatings, magnet-related devices, and specialized research fields. As a sputtering target, Dy enables controlled deposition of metallic dysprosium films and dysprosium-containing multilayer structures.

Detailed Description

Our Dysprosium Sputtering Targets are produced from carefully refined rare earth metal with tightly controlled impurity levels. Due to dysprosium’s high reactivity, especially toward oxygen, the manufacturing and handling processes are conducted under controlled environments to preserve purity and surface integrity.

The targets are typically fabricated through vacuum melting and precision machining to achieve uniform composition and high density. A dense and homogeneous microstructure ensures stable plasma behavior and consistent sputtering rates during deposition. Dysprosium targets are conductive and compatible with DC sputtering systems, though RF sputtering may also be used depending on equipment configuration. Custom diameters, thicknesses, and bonding options (such as copper backing plates) are available for enhanced thermal management in higher-power systems.

Applications

Dysprosium Sputtering Targets are used in a variety of advanced thin film applications, including:

  • Magnetic thin films and multilayer structures

  • Rare earth–based alloy coatings

  • Research in magneto-optical materials

  • Neutron absorption and nuclear-related coatings

  • Functional coatings in advanced electronic devices

  • Academic and industrial R&D in rare earth materials

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionDyDetermines magnetic and neutron absorption properties
Purity99.9% – 99.99%Reduces impurity-induced defects
Diameter25 – 200 mm (custom available)Compatible with sputtering systems
Thickness3 – 10 mmInfluences target lifetime
Density≥ 99% theoreticalImproves plasma stability
Sputtering ModeDC / RF sputteringSuitable for conductive metal
BondingUnbonded / Cu backing (optional)Enhances heat dissipation

Comparison with Related Rare Earth Targets

MaterialKey AdvantageTypical Application
Dysprosium (Dy)High magnetic momentMagnetic thin films
Neodymium (Nd)Strong permanent magnet propertiesMagnetic devices
Terbium (Tb)Magnetostrictive behaviorSensors & actuators
Gadolinium (Gd)High neutron capture cross-sectionNuclear & research films

FAQ

QuestionAnswer
Can the Dy target be customized?Yes, size, thickness, purity, and bonding options can be tailored.
Is DC sputtering suitable for dysprosium?Yes, Dy is conductive and compatible with DC sputtering.
How should dysprosium targets be stored?In a dry, inert environment to minimize surface oxidation.
How is the target packaged?Vacuum-sealed with moisture protection and export-grade cartons or crates.

Packaging

Our Dysprosium Sputtering Targets are carefully vacuum-sealed and packaged to prevent oxidation and contamination. Clear labeling ensures traceability, and export-grade packaging protects the targets during international transportation.

Conclusion

Dysprosium (Dy) Sputtering Target provides a reliable solution for depositing high-purity rare earth metal thin films with strong magnetic and functional properties. With controlled composition, high density, and flexible customization options, it is well suited for advanced magnetic coatings and specialized research applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

Dy foil 0.100×10×10 mm 5 pcs min, Dy target 99.5% Ø30×30 mm, Dy Foil 3N 20×20 mm × 0.1 mm, Dy Foil 3N 20×20 mm × 0.2 mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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