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ST0012 Dysprosium Sputtering Target, Dy

Chemical Formula: Dy
Catalog Number: ST0012
CAS Number: 7429-91-6
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Dysprosium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Availability: 1 in stock

Dysprosium Sputtering Target Description

Dysprosium

The dysprosium sputtering target is a silvery metallic target made from high-purity dysprosium metal. Dysprosium, symbolized as “Dy,” derives its name from the Greek word ‘dysprositos,’ meaning “hard to get.” First mentioned in 1886 by P.E.L. de Boisbaudran, dysprosium has an atomic number of 66, located in Period 6, Group 3 of the periodic table, and belongs to the f-block. Its relative atomic mass is 162.500(1) Dalton, with the number in brackets indicating uncertainty.

Dysprosium Sputtering Target Specification

Material Type Dysprosium
Symbol Dy
Color/Appearance Silvery White, Metallic
Melting Point 1,412 °C
Thermal Conductivity 11 W/m.K
Density 8.55 g/cc
Sputter DC
Coefficient of Thermal Expansion 9.9 x 10-6/K
Available Sizes Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Dysprosium Sputtering Target Application

The dysprosium sputtering target is used for thin film deposition. Dysprosium alloyed with stainless steel is employed in nuclear control applications. As a cermet, dysprosium cools nuclear reactor control rods by absorbing neutrons without contracting or swelling under prolonged neutron bombardment. Combined with rare-earth metals like vanadium, dysprosium is used as a laser material. Dysprosium-cadmium chalcogenides serve as a source of infrared radiation.

Handling Notes

  • Bonding services for dysprosium sputtering targets are currently unavailable.
  • Due to its high chemical reactivity, dysprosium sputtering targets require oil packaging and thorough cleaning to prevent environmental reactions.

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TFM offers Dysprosium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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