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VD0547 Europium Evaporation Materials, Eu

Catalog No.VD0547
CAS No.7440-53-1
MaterialEuropium (Eu)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a premier manufacturer and supplier of high-purity europium evaporation materials. We offer a diverse range of evaporation materials in powder and granule forms, with tailored options available to meet specific requirements.

 

MSDS File

Europium Evaporation Materials Description

Europium, a rare earth element named after Europe, stands out as the most reactive and softest among the lanthanides. Its unique properties make high-purity europium evaporation materials essential for achieving top-notch quality in deposited films. TFM excels in manufacturing europium evaporation materials with purity levels reaching up to 99.9%. We employ stringent quality control measures to ensure the consistency and reliability of our products.

europium evaporation materials

Europium Evaporation Materials Specification

Material TypeEuropium
SymbolEu
Color/AppearanceSilvery White, Metallic
Melting Point822 °C
Density5.26 g/cc
SynonymsEr Pellets, Er Pieces, Er Evaporation Pellet, Europium Pellets, Europium Pieces, Europium Evaporation Pellet

Europium Evaporation Materials Applications

Europium is widely used in various deposition techniques, including semiconductor deposition, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD). These processes are crucial for producing high-quality thin films and coatings. Additionally, europium plays a significant role in optics, where it is employed in applications such as enhancing wear resistance, applying decorative coatings, and improving display technologies.

Europium Evaporation Materials Packaging

We meticulously handle our europium evaporation materials to avoid any damage during storage and transportation, ensuring that their quality remains intact and they arrive in pristine condition.

 

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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