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ST0308 Germanium (II) Selenide Sputtering Target, GeSe2

Chemical Formula: GeSe2
Catalog Number: ST0308
CAS Number: 12065-11-1
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Germanium (II) Selenide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Germanium (II) Selenide Sputtering Target Description

A Germanium Selenide Sputtering Target is a type of ceramic material composed of germanium and selenium, used in sputtering processes. This target is typically employed in thin film deposition and various specialized applications due to the unique properties of the germanium-selenium combination.

Germanium

Germanium is a chemical element with the symbol “Ge” and an atomic number of 32. The name “germanium” is derived from the Latin word ‘Germania,’ referring to Germany. It was first mentioned in 1886 and observed by Clemens Winkler. Germanium is located in Period 4 and Group 14 of the periodic table, belonging to the p-block elements. Its relative atomic mass is approximately 72.64 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product: Germanium (Ge) Sputtering Target

SeleniumSelenium is a chemical element originated from Moon (with the Greek name selene). It was first mentioned in 1817 and observed by J. Berzelius and G. Gahn. The isolation was later accomplished and announced by J. Berzelius and G. Gahn. “Se” is the canonical chemical symbol of selenium. Its atomic number in the periodic table of elements is 34 with location at Period 4 and Group 16, belonging to the p-block. The relative atomic mass of selenium is 78.96(3) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Selenium (Se) Sputtering Target

Germanium (II) Selenide Sputtering Target Application

The Germanium (II) Selenide Sputtering Target is utilized in a variety of applications, including thin film deposition and decorative coatings. It is widely employed in the semiconductor industry, display technologies, and the production of LEDs and photovoltaic devices. Additionally, this material is significant for functional coatings, the optical information storage industry, glass coatings for automotive and architectural glass, and optical communication technologies.

Germanium (II) Selenide Sputtering Target Packing

Our Germanium (II) Selenide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take extensive precautions to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

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TFM offers Germanium (II) Selenide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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