Product Overview
Gold Copper Sputtering Targets is a composition-specific sputtering target for thin-film deposition and PVD process development. The practical specification normally includes chemistry, purity, dimensions, density, target configuration, and any bonding or backing requirement needed by the sputtering cathode.
Material and Deposition Characteristics
Power mode and process conditions should be selected according to the target conductivity, thermal behavior, and the requirements of the cathode system. For less common materials, conservative initial power density and film-composition verification are good practice.
Technical Data
| Parameter | Typical Value / Range | Importance |
|---|---|---|
| Purity | 99.9% – 99.99% metals | Higher purity improves film conductivity and device reliability |
| Composition | Custom Au/Cu ratios | Allows tuning of electrical and mechanical properties |
| Density | ≥99% theoretical | Ensures stable sputtering and uniform deposition |
| Diameter | 25 – 300 mm (custom) | Compatible with various sputtering cathodes |
| Thickness | 3 – 6 mm | Influences sputtering rate and target lifetime |
| Bonding | Copper backing plate (optional) | Improves heat transfer and structural stability |
| Material | Key Advantage | Typical Application |
|---|---|---|
| Gold Copper (Au/Cu) | High conductivity with improved mechanical durability | Electronic contacts and conductive coatings |
| Pure Gold (Au) | Exceptional corrosion resistance and conductivity | Microelectronics and bonding layers |
| Copper (Cu) | Excellent electrical conductivity and low cost | Interconnects and conductive films |
| Question | Answer |
|---|---|
| Can the Au/Cu sputtering target composition be customized? | Yes, the ratio of gold to copper can be tailored to meet specific electrical and mechanical performance requirements. |
| Which sputtering method is recommended for Au/Cu targets? | DC magnetron sputtering is typically used because the alloy is electrically conductive. |
| Are bonded targets available? | Yes, Au/Cu sputtering targets can be indium-bonded or elastomer-bonded to copper backing plates for improved thermal management. |
| What substrates are compatible with Au/Cu thin films? | Silicon wafers, glass, ceramics, and metal substrates are commonly used depending on the application. |
| Which industries commonly use Au/Cu sputtering targets? | Semiconductor manufacturing, microelectronics production, precision instrumentation, and materials science research. |
Typical Thin-Film Applications
- Thin-film research and materials-development projects requiring a composition-specific sputtering source
- Semiconductor, optical, energy, electronic, or laboratory coatings depending on the material system
- Custom R&D work where target composition, purity, and geometry need to be specified together
Target Configuration and Ordering Considerations
For quotation and manufacturability review, provide target size, thickness, purity or alloy composition, quantity, and the sputtering gun or cathode model if known. If a bonded assembly is required, include backing-plate material, bonding preference, and any dimensional tolerances, surface-finish needs, or inspection-document requirements. TFM can also review customer drawings or old-target samples for replacement builds.
Frequently Asked Questions
What is the main reason to use a Gold Coppers sputtering target?
It provides a composition-specific source for thin-film deposition when the target material itself is important to the desired film chemistry or process.
How should the sputtering mode for Gold Coppers be selected?
The power mode should be chosen according to target conductivity, thermal behavior, and equipment capability. Less-conductive materials are commonly evaluated with RF power.
Why are density and microstructure important for Gold Coppers targets?
These factors can influence erosion stability, thermal behavior, particle generation, and the risk of cracking or local hot spots.
Can Gold Coppers be supplied with a backing plate?
Yes. If the material is brittle or the cathode requires it, a bonded configuration can be reviewed according to target size, thickness, cooling, and power.
Does target composition always equal film composition?
No. Film chemistry may differ because of sputtering yields, process conditions, substrate temperature, re-sputtering, and chamber history. Film verification is recommended when composition matters.
What should I provide to request a quotation for Gold Coppers?
Please provide the composition, purity, dimensions, quantity, target configuration, cathode details, and any drawing or inspection requirements.
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