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ST0486 Gold Palladium Sputtering Target, Au/Pd

Chemical Formula: Au/Pd
Catalog Number: ST0486
Purity: 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Gold Palladium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Gold Palladium Sputtering Target Description

GoldGold, a chemical element with the symbol “Au” derived from the Latin word *aurum*, meaning “glow of sunrise,” has a rich history dating back to before 6000 BC when it was first used by people in the Middle East. Its atomic number is 79, placing it in Period 6 and Group 11 of the periodic table, within the d-block. Gold’s relative atomic mass is 196.966569(4) Dalton, with the number in brackets indicating the uncertainty in its measurement.

PalladiumPalladium, a member of the platinum group of metals, is known for its lustrous silver-white appearance and face-centered cubic crystalline structure. At room temperature, it is highly resistant to corrosion in air and most acids, though it can be attacked by hot acids and dissolves in aqua regia. Palladium forms various compounds and complex salts and exhibits good corrosion resistance. However, it is soluble in oxidizing acids and fused alkalis. One of its notable properties is its ability to absorb hydrogen gas, up to 900 times its own volume. Palladium’s primary application is as a catalyst in hydrogenation processes.

Related Products: Gold Sputtering Target, Palladium Sputtering Target

Gold Palladium Sputtering Target Specifications

Material Type Gold Palladium
Symbol Au/Pd
Color/Appearance Solid
Melting Point 1410 °C
Density 16 g/cm3
Available Sizes Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Packing

Our Gold Palladium Sputtering Targets are meticulously tagged and labeled on the exterior to facilitate easy identification and ensure rigorous quality control. We take every precaution to protect the targets from any potential damage during storage and transportation.

Get Contact

TFM offers Gold Palladium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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