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Hafnium Nitride Evaporation Materials

VD0752 Hafnium Nitride Evaporation Materials, HfN

Catalog No.VD0752
MaterialHafnium Nitride (HfN)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands out as a leading manufacturer and supplier of high-purity Hafnium Nitride evaporation materials, as well as a diverse range of other evaporation materials. We provide these materials in both powder and granule forms, with customized shapes available upon request to meet specific needs.

MSDS File

Hafnium Nitride Evaporation Materials Description

Hafnium Nitride evaporation materials from TFM are high-performance nitride ceramic materials with the chemical formula HfN. These materials are essential for ensuring high-quality films in various deposition processes. TFM specializes in producing Hafnium Nitride materials with purity levels reaching up to 99.9995%, adhering to rigorous quality assurance processes to ensure product reliability.

Hafnium Nitride Evaporation Materials Specification

Material TypeHafnium Nitride
SymbolHfN
Appearance/ColorYellow-brown
Melting PointN/A
Density13800 kg/m-3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications

Hafnium Nitride evaporation materials are utilized in a range of applications including:

  • Deposition Processes: Key for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics and Coatings: Ideal for wear protection, decorative coatings, and displays.

Packaging and Handling

Our Hafnium Nitride evaporation materials are meticulously tagged and labeled to ensure efficient identification and maintain quality control. We take great care to prevent any damage during storage and transportation.

Contact Us

TFM is a prominent manufacturer and supplier of high-purity Hafnium Nitride evaporation materials. We offer these materials in various forms, including tablets, granules, rods, and wires, with custom shapes and quantities available upon request. In addition, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about additional materials, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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