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Indium Aluminum Zinc Oxide Sputtering Target

ST0438 Indium Aluminum Zinc Oxide Sputtering Target, In2O3/Al2O3/ZnO, 65/16/19 wt%

Chemical Formula: (In2O3/Al2O3/ZnO) 65/16/19 wt%
Catalog Number: ST0438
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Indium Aluminum Zinc Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Indium Aluminum Zinc Oxide Sputtering Target Description

Indium aluminum zinc oxide sputtering target is composed of indium oxide, aluminum oxide, and zinc oxide with the chemical formula of In2O3/Al2O3/ZnO. The composition ratio is 65 wt%, 16 wt%, and 19 wt%, respectively. High-purity indium aluminum zinc oxide sputtering targets play a huge role in deposition processes to ensure high-quality deposited films. TFM specializes in producing up to 99.9995% purity sputtering targets using quality assurance processes to guarantee product reliability.

Related products: Indium Sputtering Target, Aluminum Sputtering Target, Zinc Sputtering Target

IndiumAluminumZincOxygen

Indium Aluminum Zinc Oxide Sputtering Target Specification

Material Type Indium Aluminum Zinc Oxide
Symbol In2O3/Al2O3/ZnO
Color/Appearance Solid
Melting Point N/A
Density N/A
Type of Bond Elastomer, Indium
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Indium Aluminum Zinc Oxide Sputtering Target Application

The indium aluminum zinc oxide sputtering target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as well as other optical information storage space industries, glass coating industries like car glass and architectural glass, optical communication, etc.

Indium Aluminum Zinc Oxide Sputtering Target Packaging

Our indium aluminum zinc oxide sputter targets are carefully handled to prevent damage during storage and transportation and to preserve the quality of our products in their original condition.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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