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VD0691 Indium Iron Oxide Evaporation Materials, InFe2O4

Catalog No.VD0691
MaterialIndium Iron Oxide (InFe2O4)
Purity99.9%%
ShapePowder/ Granule/ Custom-made
TFM is a top-tier manufacturer and supplier specializing in high-purity indium iron oxide evaporation materials, along with an extensive range of other evaporation materials. We provide these materials in both powder and granule forms, and we can also accommodate custom requests to meet specific needs.
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Indium Iron Oxide Evaporation Materials Overview

TFM offers premium indium iron oxide evaporation materials, an oxide with the chemical formula InFe₂O₄. Known for its exceptional purity, this material is essential in deposition processes, ensuring the production of high-quality films. TFM takes pride in delivering evaporation materials with up to 99.9995% purity, achieved through rigorous quality assurance practices that guarantee the reliability and consistency of each product.

Related Products: Indium Evaporation Materials, Iron Evaporation Materials, Oxide Ceramic Evaporation Materials.

Applications of Indium Iron Oxide Evaporation Materials

Indium iron oxide evaporation materials from TFM are versatile and are utilized in various high-tech applications, including:

  • Deposition Processes: Ideal for semiconductor deposition, as well as chemical vapor deposition (CVD) and physical vapor deposition (PVD) techniques.
  • Optical Applications: Used for wear-resistant coatings, decorative layers, and display technologies.

Packaging and Handling

To ensure the highest standards of quality control, TFM meticulously tags and labels all indium iron oxide evaporation materials. Our packaging process is designed to prevent any potential damage during storage or transportation, ensuring that the materials arrive in optimal condition.

Contact TFM

As a leading provider of high-purity indium iron oxide evaporation materials, TFM offers a variety of shapes, including tablets, granules, rods, and wires. We also cater to custom specifications and quantities upon request. In addition to evaporation materials, TFM supplies a wide range of related products, including evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing and inquiries about our evaporation materials or other products, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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