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ST0154 Indium Tin Oxide Sputtering Target, In2O3/SnO2

Chemical Formula: In2O3/SnO2
Catalog Number: ST0154
CAS Number: 50926-11-9
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tin Oxide (ITO) sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Indium Tin Oxide (ITO) sputtering targets, composed of indium oxide (In₂O₃) and tin oxide (SnO₂), are the industry standard material for depositing transparent conductive oxide (TCO) films. ITO combines high electrical conductivity with excellent optical transparency in the visible spectrum, making it indispensable in display technology, photovoltaics, and optoelectronic devices.

As a mature yet continuously evolving material, ITO remains the preferred choice for applications requiring a balance between low resistivity and high light transmission.

Detailed Description

ITO sputtering targets are typically fabricated from a sintered ceramic composite of In₂O₃ and SnO₂, with common compositions such as 90 wt% In₂O₃ / 10 wt% SnO₂. The addition of tin oxide introduces free carriers into the indium oxide lattice, significantly enhancing electrical conductivity while maintaining optical clarity.

High-density ITO targets are produced through advanced powder processing and hot pressing or isostatic pressing techniques to achieve:

  • High relative density (≥ 99% theoretical density)

  • Uniform grain distribution

  • Low porosity for stable sputtering

  • Controlled oxygen stoichiometry

These factors directly influence film properties such as sheet resistance, transmittance, carrier concentration, and deposition stability. For large-area coating systems, targets can be supplied as planar or rotary configurations. Bonding options, including indium bonding to copper backing plates, are available to improve heat dissipation and mechanical stability during high-power sputtering.

ITO targets are compatible with DC, pulsed DC, and RF sputtering systems, depending on composition and resistivity.

Applications

ITO sputtering targets are widely used in:

  • Flat Panel Displays (LCD, OLED, Touch Panels)
    Transparent conductive layers for electrodes and pixel structures.

  • Solar Cells & Photovoltaics
    Front electrodes in thin-film solar cells and perovskite devices.

  • Smart Glass & Low-E Coatings
    Transparent conductive coatings for architectural and automotive glass.

  • LED & Optoelectronic Devices
    Transparent electrodes for light-emitting devices.

  • EMI Shielding Films
    Transparent shielding layers for electronic devices.

  • Research & Functional Thin Films
    Used in R&D for nanostructured TCO films and advanced transparent electronics.

Technical Parameters

ParameterTypical Value / RangeImportance
Composition90/10 wt% (In₂O₃/SnO₂) commonBalances conductivity & transparency
Purity99.9% – 99.99% (3N–4N)Reduces impurities affecting film quality
Density≥ 99% theoretical densityEnsures stable sputtering & uniform films
Diameter1″ – 8″ (custom up to large size)Matches sputtering cathodes
Thickness3 – 10 mmInfluences lifetime & deposition rate
BondingIndium bonded to Cu backing plateImproves heat transfer & reduces cracking
FormPlanar / RotarySuitable for batch or in-line systems

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Indium Tin OxideHigh transparency + low resistivityDisplays & photovoltaics
Aluminum-Doped Zinc Oxide (AZO)Lower material costLarge-area coatings
Fluorine-Doped Tin Oxide (FTO)Better chemical stability in some processesSolar cells
Zinc Oxide (ZnO)High transparencyResearch & optics

ITO remains the dominant solution where superior conductivity and optical performance are required simultaneously.

FAQ

QuestionAnswer
Can the In₂O₃/SnO₂ ratio be customized?Yes, compositions such as 95/5 or 80/20 are available based on conductivity and transparency requirements.
Are rotary ITO targets available?Yes, both planar and rotary configurations can be supplied.
Is bonding recommended for high-power sputtering?Yes, copper backing plates significantly improve thermal management and target stability.
What deposition methods are compatible?DC, pulsed DC, and RF sputtering systems are supported.
How is the product packaged?Vacuum-sealed with protective foam and export-safe cartons or wooden crates.

Packaging

Our Indium Tin Oxide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Indium Tin Oxide (In₂O₃/SnO₂) sputtering targets continue to be the backbone of transparent conductive film technology. With optimized density, composition control, and reliable bonding options, they deliver consistent film performance across display, photovoltaic, and advanced optoelectronic applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

In₂O₃–SnO₂ target 90/10 at% 4N ø76.2×3mm Indium Bonded to Cu B/Plate

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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