Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
Indium Zinc Oxide Sputtering Target

ST0155 Indium Zinc Oxide Sputtering Target, IZO

Chemical Formula: In2O3/ZnO
Catalog Number: ST0155
CAS Number: 117944-65-7
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Indium Zinc Oxide (IZO) sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Indium Zinc Oxide Sputtering Target

Introductionindium-zinc-oxide

The Indium Zinc Oxide (IZO) Sputtering Target is a key material in the thin film industry, known for its excellent electrical conductivity and high optical transparency. As a mixed oxide composed of indium oxide (In₂O₃) and zinc oxide (ZnO), it serves as an advanced alternative to ITO (Indium Tin Oxide) in transparent conductive film applications, offering improved stability, flexibility, and lower deposition temperatures.

Detailed Description

Indium Zinc Oxide (IZO) targets typically contain 5–20 wt% ZnO and 80–95 wt% In₂O₃, optimized to balance conductivity and transparency. The addition of ZnO enhances the film’s chemical stability and flexibility, making it suitable for next-generation electronics and display technologies.

IZO sputtering targets are produced via hot pressing or vacuum sintering, resulting in a dense and homogeneous ceramic structure. This ensures uniform sputtering rates, reduced particle generation, and superior adhesion on glass or polymer substrates.

Key Features:

  • High transparency (>85%) in the visible light range.

  • Low resistivity and stable electrical properties.

  • Excellent adhesion and film uniformity.

  • Low processing temperature, compatible with plastic and flexible substrates.

  • Custom ZnO ratios available for specific device needs.

Applications

Indium Zinc Oxide sputtering targets are widely used in:

  • Flat-panel displays (FPDs) – including OLED and LCD electrodes.

  • Touch screens and flexible electronics.

  • Photovoltaic devices – transparent conductive layers in solar cells.

  • Optoelectronic devices – such as LEDs and sensors.

  • Smart windows and low-emissivity glass coatings.

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical Formula(In₂O₃)₁₋ₓ(ZnO)ₓDefines optical & electrical balance
Purity99.9% – 99.99%Ensures clean and defect-free films
Composition RatioIn₂O₃:ZnO = 90:10 (wt%)Tunable for performance optimization
Density≥ 7.1 g/cm³Improves sputtering efficiency
Diameter25 – 300 mm (custom)Fits all sputtering systems
Thickness3 – 10 mmDetermines sputtering lifetime
Backing PlateCopper / TitaniumImproves heat transfer and mechanical stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Indium Zinc Oxide (IZO)High transparency & flexibilityTouch panels & displays
Indium Tin Oxide (ITO)High conductivity, rigidGlass-based coatings
Aluminum Zinc Oxide (AZO)Cost-effective, transparentSolar cells
Fluorine-doped Tin Oxide (FTO)Durable, conductive at high tempsArchitectural glass

FAQ

QuestionAnswer
Can the ZnO ratio be customized?Yes, ZnO content can be tailored (typically 5–20 wt%) to control resistivity and transparency.
What bonding options are available?Commonly copper or titanium backing plates.
Is IZO compatible with flexible substrates?Yes, it can be sputtered at lower temperatures, ideal for polymer substrates.
How is it packaged?Vacuum-sealed with desiccant, foam protection, and export-safe wooden crates.
What industries use IZO most?Displays, photovoltaics, and optoelectronics.

Indium Zinc Oxide Sputtering Target Bonding Service

Specialized bonding services for Indium Zinc Oxide Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Packaging

Each Indium Zinc Oxide Sputtering Target is individually vacuum-packed in a clean environment with protective foam and clear labeling. Export packaging includes moisture-proof wrapping and reinforced cartons or crates to ensure safe transport.

Conclusion

The Indium Zinc Oxide Sputtering Target offers a superior combination of transparency, conductivity, and flexibility, making it a preferred choice for modern optoelectronic devices and display technologies. Its stable deposition behavior and customizable composition enable precise thin film engineering across multiple industries.

For detailed specifications and quotations, please contact us at [sales@thinfilmmaterials.com].

 

Order Now

IZO Target 90:10 wt% 4N ø76.2×6.35mm Indium Bonded 3mm Cu B/Plate, IZO target 4N 85/15 wt% ø50.8×4mm Indium Bonded 2mm Cu B/Plate <6.35mm

Reviews

There are no reviews yet.

Be the first to review “ST0155 Indium Zinc Oxide Sputtering Target, IZO”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top