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Iron Aluminum Silicon Sputtering Target

ST0495 Iron Aluminum Silicon Sputtering Target, Fe/Al/Si

Chemical Formula: Fe/Al/Si
Catalog Number: ST0495
Purity: 99%~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Iron Aluminum Silicon sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Iron Aluminum Silicon Sputtering Target Description

ironIron, also known as ferrum, derives its name from the Anglo-Saxon word *iren* (with *ferrum* being the Latin term). It has been used since before 5000 BC. The chemical symbol for iron is “Fe,” and it has an atomic number of 26, positioning it in Period 4 and Group 8 of the periodic table, within the d-block. The relative atomic mass of iron is 55.845(2) Dalton, with the number in brackets indicating the uncertainty.

AluminumAluminum, or Aluminium, is a silvery-white, soft, non-magnetic, and ductile metal. Due to its high reactivity, native aluminum is rare and usually only found in highly reducing environments. Instead, it occurs in over 270 different minerals. When evaporated in a vacuum, aluminum forms a reflective coating used in telescopes, automotive headlamps, mirrors, packages, and toys. It is extensively utilized in the aerospace, automotive lighting, OLED, and optical industries.

Silicon

Silicon is a chemical element derived from the Latin word ‘silex’ or ‘silicis’, meaning flint. It was first mentioned in 1824 and observed by J. Berzelius. The isolation was later accomplished and announced by J. Berzelius. Its canonical chemical symbol is “Si”. Silicon has an atomic number of 14, is located at Period 3 and Group 14 in the periodic table, and belongs to the p-block. Its relative atomic mass is 28.0855(3) Dalton, with the number in brackets indicating the uncertainty.

Related Products: Iron Sputtering Target, Aluminum Sputtering Target, Silicon Sputtering Target.

Iron Aluminum Silicon Sputtering Target Specifications

Material Type Iron Aluminum Silicon
Symbol Fe/Al/Si
Color/Appearance Metallic solid in various forms including powder, sputtering target, foil, bar, plate
Melting Point /
Density /
Available Sizes Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Packing

Our Iron Aluminum Silicon Sputtering Targets are meticulously labeled and tagged to facilitate clear identification and maintain stringent quality control. We prioritize protecting these targets from any potential damage during storage and shipping to ensure they arrive in pristine condition.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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