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VD0627 Iron Chromium Evaporation Materials, Fe/Cr

Catalog No.VD0627
MaterialIron Chromium (Fe/Cr)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) specializes in manufacturing high-purity iron chromium evaporation materials, ensuring exceptional product reliability through rigorous quality assurance processes. We offer these materials in a range of forms, including tablets, granules, pellets, and powder, to meet diverse application needs.

Iron Chromium Evaporation Materials Overview

Thin-Film Mat Engineering (TFM) provides high-purity iron chromium evaporation materials, an alloy of iron (Fe) and chromium (Cr). These materials are essential in various deposition processes, ensuring the production of high-quality films. Our iron chromium evaporation materials achieve purity levels of up to 99.9995%, and are manufactured with rigorous quality assurance to ensure dependable performance and reliability.

Applications of Iron Chromium Evaporation Materials

Iron chromium evaporation materials are used in a variety of applications, including:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Employed in wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

We take great care in handling and packaging our iron chromium evaporation materials to prevent damage and preserve their quality during storage and transportation.

Contact Us

At TFM, we are a leading manufacturer and supplier of high-purity iron chromium evaporation materials and offer a broad range of evaporation products. Available in powder and granule forms, with customized options upon request, our materials are suited to various industrial needs. For pricing information and details on additional deposition materials, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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