Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
Awaiting product image

Iron Manganese Sputtering Target, Fe/Mn

Chemical Formula: Fe/Mn
Catalog Number: TFM-SPT-0287
CAS Number: 7439-89-6 | 7439
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Iron Manganese sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Product Overview

Iron Manganese Sputtering Target (Fe/Mn) is an alloy sputtering target used to deposit composition-controlled alloy films. Relative to a pure elemental target, the alloying constituents are introduced to tune electrical, magnetic, optical, mechanical, or adhesion-related film properties. For this reason, alloy ratio, homogeneity, purity basis, and the intended film composition should be defined clearly in the procurement specification.

Material and Deposition Characteristics

Many alloy targets are electrically conductive and can be compatible with DC or pulsed-DC magnetron sputtering, subject to the actual alloy composition and equipment capability. The target composition is not always reproduced exactly in the deposited film because preferential sputtering, re-sputtering, substrate heating, and process gas conditions can shift the final ratio. For composition-sensitive work, deposited-film analysis should be part of process qualification.

Technical Data

ParameterTypical Value / RangeImportance
Alloy CompositionFe/Mn (custom ratios available)Controls magnetic behavior
Purity99.9% – 99.99%Improves film consistency
Target Diameter25 – 300 mm (custom)Fits standard sputtering guns
Thickness3 – 6 mm (custom available)Influences sputtering stability
Density≥ 99% of theoreticalEnsures uniform erosion
Backing PlateOptional (Cu / Ti)Enhances thermal management
Deposition MethodDC / RF Magnetron SputteringProcess flexibility
MaterialKey AdvantageTypical Application
Iron Manganese (Fe/Mn)Tunable antiferromagnetic propertiesSpintronics & sensors
Iron Cobalt (FeCo)High magnetic saturationMagnetic cores
Nickel Iron (NiFe)Soft magnetic behaviorMagnetic shielding
Cobalt Manganese (CoMn)Exchange bias controlMagnetic multilayers
QuestionAnswer
Can the Fe/Mn ratio be customized?Yes, alloy composition can be tailored to application requirements.
Is DC sputtering suitable?Yes, DC sputtering is commonly used for Fe/Mn alloy targets.
Is bonding recommended?Bonded targets are recommended for larger sizes or higher power use.
Are small research targets available?Yes, laboratory-scale diameters and thicknesses are supported.
How is the target packaged?Vacuum-sealed with protective cushioning to prevent oxidation.

Typical Thin-Film Applications

  • Iron Manganese alloy films where composition control is important to electrical, mechanical, magnetic, or optical performance
  • Multilayer stacks, adhesion/barrier layers, conductive films, or functional coatings depending on the alloy system
  • Research and production programs that require customized alloy ratios and repeatable sputtering behavior

Target Configuration and Ordering Considerations

For quotation and manufacturability review, provide target size, thickness, purity or alloy composition, quantity, and the sputtering gun or cathode model if known. If a bonded assembly is required, include backing-plate material, bonding preference, and any dimensional tolerances, surface-finish needs, or inspection-document requirements. TFM can also review customer drawings or old-target samples for replacement builds.

Frequently Asked Questions

Can the composition of a Iron Manganese sputtering target be customized?

Yes. For alloy targets, the required ratio should be specified clearly in wt% or at%. TFM can review custom compositions together with purity, dimensions, and manufacturability.

Will an alloy target always produce a film with the same composition?

Not necessarily. Preferential sputtering, substrate heating, process gas, and re-sputtering effects can shift the deposited composition relative to the nominal target chemistry. Film analysis should be used when the composition is critical.

Is a Iron Manganese alloy target compatible with DC magnetron sputtering?

Many metallic alloy targets are electrically conductive and can be compatible with DC or pulsed-DC sputtering, but the final choice depends on the actual alloy system and equipment.

Why is alloy homogeneity important in a Iron Manganese target?

A uniform alloy distribution helps support stable erosion and reduces local composition variation across the target, which in turn helps improve run-to-run consistency.

Can a Iron Manganese target be supplied bonded?

Yes. Where the cathode or thermal load requires it, TFM can supply bonded assemblies. Backing-plate material, target thickness, bonding method, and operating power should be reviewed together.

What should I include in an RFQ for Iron Manganese?

Specify the alloy composition, purity basis, dimensions, quantity, backing requirement, cathode model or drawing, and any tolerance, inspection, or documentation requirements.

Order Now

FeMn Target 50–50 at% 3N Ø50.8 mm × 5 mm

Reviews

There are no reviews yet.

Be the first to review “Iron Manganese Sputtering Target, Fe/Mn”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top