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Lanthanum Aluminate Sputtering Target

ST0158 Lanthanum Aluminate Sputtering Target, LaAlO3

Chemical Formula: LaAlO3
Catalog Number: ST0158
CAS Number: 12003-65-5
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lanthanum Aluminate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lanthanum Aluminate Sputtering Target Description

The Lanthanum Aluminate Sputtering Target from TFM is an oxide sputtering material composed of lanthanum (La), aluminum (Al), and oxygen (O).

LanthanumLanthanum is a soft, malleable, silvery-white metal and is one of the most reactive rare earth elements. It is used in a variety of applications, including the production of special optical glasses and the improvement of steel malleability. Lanthanum is also valuable in wastewater treatment and oil refining processes. Additionally, scientists have nicknamed lanthanum “super calcium” because of its use in photoconversion films, which are used to enhance the efficiency of solar cells by converting ultraviolet light into visible light.

Related Product: Lanthanum Sputtering Target

AluminiumAluminium, also known as aluminum, is a chemical element named after the Latin word for alum, ‘alumen,’ meaning bitter salt. It was first mentioned in 1825 and observed by H.C. Ørsted, who also accomplished and announced its isolation. The chemical symbol for aluminium is “Al,” and its atomic number is 13. Aluminium is located in Period 3, Group 13 of the periodic table, within the p-block. Its relative atomic mass is 26.9815386(8) Dalton, with the number in brackets indicating the measurement uncertainty. Aluminium is widely used due to its lightweight, high strength, and excellent corrosion resistance, making it essential in industries such as aerospace, construction, and packaging.

Related Product: Aluminium Sputtering Target

OxygenOxygen is a chemical element that originated from the Greek ‘oxy’ and ‘genes’ meaning acid-forming. It was first mentioned in 1771 and observed by W. Scheele. The isolation was later accomplished and announced by W. Scheele. “O” is the canonical chemical symbol of oxygen. Its atomic number in the periodic table of elements is 8 with location at Period 2 and Group 16, belonging to the p-block. The relative atomic mass of oxygen is 15.9994(3) Dalton, the number in the brackets indicating the uncertainty.

Lanthanum Aluminate Sputtering Target Bonding Service

Specialized bonding services for  Lanthanum Aluminate Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Available Sizes of Lanthanum Aluminate Sputtering Target

MaterialSize
Lanthanum Aluminate, LaAlO31.00″ Dia. x 0.125″ Thick
Lanthanum Aluminate, LaAlO31.00″ Dia. x 0.250″ Thick
Lanthanum Aluminate, LaAlO32.00″ Dia. x 0.125″ Thick
Lanthanum Aluminate, LaAlO32.00″ Dia. x 0.250″ Thick
Lanthanum Aluminate, LaAlO33.00″ Dia. x 0.125″ Thick
Lanthanum Aluminate, LaAlO33.00″ Dia. x 0.250″ Thick
Lanthanum Aluminate, LaAlO34.00″ Dia. x 0.125″ Thick
Lanthanum Aluminate, LaAlO34.00″ Dia. x 0.250″ Thick
Lanthanum Aluminate, LaAlO36.00″ Dia. x 0.250″ Thick
Lanthanum Aluminate, LaAlO38.00″ Dia. x 0.250″ Thick

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Packing

Our Lanthanum Aluminate Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. We take extensive precautions to prevent any damage during storage and transportation, ensuring the highest standards of product integrity upon delivery.

Get Contact

TFM offers Lanthanum Aluminate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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