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ST0915 Lanthanum Strontium Cobalt Iron Oxide Sputtering Target, LSCF

Chemical Formula LiNiO2
Catalog No. ST0914
CAS Number 12031-65-1
Purity 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape Discs, Plates, Column Targets, Step Targets, Custom-made

Lanthanum Strontium Cobalt Iron Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lanthanum Strontium Cobalt Iron Oxide Sputtering Target Description

Lanthanum Strontium Cobalt Iron Oxide Sputtering Target is a specialized material used in the sputter deposition process. This compound, part of the perovskite oxide family, is widely utilized in applications such as solid oxide fuel cells (SOFCs), oxygen permeation membranes, and related fields.

In sputtering, a technique for depositing thin films onto substrates, the target material is bombarded with high-energy ions. This bombardment causes atoms or molecules to be ejected from the target surface and deposit onto the substrate, forming a thin film.

Lanthanum Strontium Cobalt Iron Oxide (LSCF) is a mixed metal oxide that integrates lanthanum, strontium, cobalt, and iron in a precise ratio. Its composition is optimized for electronic and ionic conductivity, making it particularly effective as a cathode material in SOFCs.

Related Product: Lanthanum Strontium Chromate Sputtering Target, Lanthanum Strontium Copper Oxide Sputtering Target

Lanthanum Strontium Cobalt Iron Oxide Sputtering Target Specifications

Compound Formula LaxSr1-xCoyFe1-yO3
Molecular Weight 97.63
Appearance Gray Target
Melting Point >1000℃
Density
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Lanthanum Strontium Cobalt Iron Oxide Sputtering Target Handling Notes

Indium bonding is recommended for Lanthanum Strontium Cobalt Iron Oxide Sputtering Targets due to the material’s characteristics, such as brittleness and low thermal conductivity, which are not ideal for sputtering. This material exhibits low thermal conductivity and is susceptible to thermal shock, making indium bonding a preferred choice to ensure stable performance and reliable deposition results.

Lanthanum Strontium Cobalt Iron Oxide Sputtering Target Application

Lanthanum Strontium Cobalt Iron Oxide Sputtering Target is crucial for the fabrication of materials used in advanced energy and electronic devices. Its unique properties, including high electronic and ionic conductivity, make it ideal for applications such as solid oxide fuel cells (SOFCs) and other high-performance energy solutions.

Lanthanum Strontium Cobalt Iron Oxide Sputtering Target Packaging

Our Lanthanum Strontium Cobalt Iron Oxide Sputtering Targets are meticulously handled during storage and transportation to maintain the highest quality of our products in their original condition.

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TFM offers Lanthanum Strontium Cobalt Iron Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.
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LSCF Target 4N 150*50*3mm Indium Bonded 3mm Cu B/Plate, LSCF Target 4N 150*50*6mm Indium Bonded 3mm Cu B/Plate

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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