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ST0245 Lanthanum Fluoride Sputtering Target, LaF3

Chemical Formula: LaF3
Catalog Number: ST0245
CAS Number: 13709-38-1
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lanthanum Fluoride  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lanthanum Fluoride Sputtering Target Description

Lanthanum Fluoride Sputtering Target consists of a fluoride ceramic material made from lanthanum and fluorine. This target is specifically designed for use in various sputtering processes.

LanthanumLanthanum, symbolized as La and with an atomic number of 57, is a soft, malleable, silvery-white metal and one of the more reactive rare earth elements. It is used in the production of special optical glasses and to enhance the malleability of steel. Additionally, lanthanum plays a crucial role in wastewater treatment and oil refining processes. Due to its effective use in photoconversion films, scientists often refer to lanthanum as “super calcium.”

Related Product: Lanthanum Sputtering Target

Fluorine

Fluorine, also known as fluorin, is a chemical element derived from the Latin word ‘fluere’, which means to flow. First mentioned by A.-M. Ampère in 1810, its successful isolation was later achieved and publicized by H. Moissan. Fluorine, denoted by the symbol “F”, is number 9 on the periodic table and is located in Period 2, Group 17, within the p-block. Its relative atomic mass is precisely 18.9984032(5) Dalton, with the numbers in parentheses denoting the uncertainty of this measurement.

Lanthanum Fluoride Sputtering Target Application

The Lanthanum Fluoride Sputtering Target is utilized across a variety of applications, including thin film deposition, decorative purposes, and the manufacturing of semiconductors, displays, LEDs, and photovoltaic devices. It also serves critical functions in the production of functional coatings and is used in various optical information storage industries. Additionally, this target is essential in the glass coating industry, applicable to both automotive and architectural glass, as well as in optical communication sectors.

Lanthanum Fluoride Sputtering Target Packing

Our Lanthanum Fluoride Sputter Targets are externally tagged and labeled to ensure efficient identification and rigorous quality control. We exercise extreme care to prevent any damage that could occur during storage or transportation, maintaining the integrity of the targets.

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TFM offers Lanthanum Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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