Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
lanthanum-lithium-titanate-sputtering-target-removebg-preview-1

ST0446 Lanthanum Lithium Titanate Sputtering Target, La(1-x) LixTiO3

Chemical Formula: La(1-x)LixTiO3
Catalog Number: ST0446
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lanthanum Lithium Titanate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lanthanum Lithium Titanate Sputtering Target Description

The lanthanum lithium titanate sputtering target is composed of lanthanum, lithium, titanium, and oxygen, with the chemical formula La(1-x) LixTiO3. High-purity lanthanum lithium titanate sputter targets are crucial in deposition processes to ensure high-quality deposited films. TFM specializes in producing sputtering targets with up to 99.9995% purity, employing stringent quality assurance processes to guarantee product reliability.

LanthanumLithiumTitaniumOxygen

Related products: Lanthanum Sputtering Target, Lithium Sputtering Target, Titanium Sputtering Target

Lanthanum Lithium Titanate Sputtering Target Specification

Material TypeLanthanum Lithium Titanate
SymbolLaGaO3
Color/AppearanceGray Solid
Melting PointN/A
DensityN/A
Type of BondElastomer, Indium
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Lanthanum Lithium Titanate Sputtering Target Application

The lanthanum lithium titanate sputtering target is utilized for thin film deposition, decoration, semiconductor applications, displays, LEDs, and photovoltaic devices. It is also employed in functional coatings and various optical information storage industries, as well as in the glass coating industry, including car glass and architectural glass, and optical communication sectors.

Lanthanum Lithium Titanate Sputtering Target Packaging

Our lanthanum lithium titanate sputter targets are meticulously handled to prevent any damage during storage and transportation, ensuring they maintain their original quality.

Get Contact

TFM offers Lanthanum Lithium Titanate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0446 Lanthanum Lithium Titanate Sputtering Target, La(1-x) LixTiO3”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top