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Lanthanum Lithium Titanate Sputtering Target

ST0446 Lanthanum Lithium Titanate Sputtering Target, La(1-x) LixTiO3

Chemical Formula: La(1-x)LixTiO3
Catalog Number: ST0446
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lanthanum Lithium Titanate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Lanthanum Lithium Titanate sputtering targets are advanced oxide ceramic materials widely used in thin-film research and functional coating development. Owing to their unique crystal structure and excellent ionic and dielectric properties, these targets are particularly important in solid-state batteries, oxide electronics, and advanced energy-related thin-film applications. They provide a reliable material source for depositing high-quality lithium-containing oxide films where compositional control is critical.

Detailed Description

Lanthanum Lithium Titanate, commonly known as LLTO, is a perovskite-type oxide that exhibits high lithium-ion conductivity and good chemical stability. Its structure allows lithium ions to migrate efficiently through the lattice, making LLTO an important material in next-generation solid electrolytes and electrochemical devices.

Our Lanthanum Lithium Titanate sputtering targets are produced from high-purity precursor materials through carefully controlled solid-state synthesis, calcination, and high-temperature sintering processes. These steps ensure homogeneous composition, high density, and stable mechanical strength. Precise control of lithium content is especially important, as lithium volatility can influence film stoichiometry during deposition.

The targets are suitable for RF sputtering and pulsed-DC sputtering systems commonly used for complex oxide deposition. Planar disc targets are available in standard sizes, with optional bonding to copper or other backing plates to enhance thermal conductivity and reduce cracking risk during high-power operation. Custom compositions, dimensions, and bonding solutions can be provided to meet specific research or pilot-scale requirements.

Applications

Lanthanum Lithium Titanate sputtering targets are primarily used in:

  • Solid-state battery thin films and solid electrolytes

  • Lithium-ion conducting oxide films

  • Energy storage and conversion research

  • Oxide electronics and functional ceramic coatings

  • Thin-film capacitors and dielectric layers

  • Academic and industrial R&D on lithium-based oxides

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialLanthanum Lithium Titanate (LLTO)Defines ionic & dielectric behavior
Purity99.9% – 99.99%Minimizes impurity-related defects
Crystal StructurePerovskite-type oxideEnables lithium-ion conduction
Diameter1″ – 4″ (custom available)Fits standard sputtering systems
Thickness3 – 6 mmAffects sputtering lifetime
Density≥ 95% of theoreticalEnsures stable sputtering rate
Backing PlateOptional Cu / TiImproves heat dissipation & stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Lanthanum Lithium TitanateHigh lithium-ion conductivitySolid-state battery films
Lithium Lanthanum Zirconate (LLZO)Wide electrochemical windowSolid electrolytes
Lithium Cobalt Oxide (LCO)High energy densityBattery cathode films
Titanium Oxide (TiO₂)Chemical stabilityFunctional oxide coatings

FAQ

QuestionAnswer
Can the lithium content be customized?Yes, stoichiometry can be adjusted based on application needs.
Is this target suitable for RF sputtering?Yes, it is commonly used with RF and pulsed-DC sputtering.
Are bonded targets available?Yes, bonded targets with copper or other backing plates are available.
How do you control lithium loss?Optimized synthesis and high-density sintering help maintain composition stability.

Packaging

Our Lanthanum Lithium Titanate Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. Each target is vacuum-sealed and protected with shock-absorbing materials to prevent damage or contamination during storage and transportation.

Conclusion

Lanthanum Lithium Titanate sputtering targets provide a stable and reliable solution for depositing lithium-conducting and dielectric oxide thin films. With high density, controlled composition, and flexible customization options, they are well suited for advanced energy storage research and functional oxide applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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Li0.38La0.56TiO3 target 3N ø101.6×3.18mm Indium Bonded to Cu B/Plate with Keeper

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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