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ST0161 Lanthanum Nickel Oxide Sputtering Target, LaNiO3

Chemical Formula: LaNiO3
Catalog Number: ST0161
CAS Number: 12031-18-4
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made
Lanthanum Nickel Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lanthanum Nickel Oxide Sputter Target Description

The Lanthanum Nickel Oxide Sputtering Target from TFM is an oxide sputtering material composed of lanthanum (La), nickel (Ni), and oxygen (O).

LanthanumLanthanum is a soft, malleable, silvery-white metal and one of the most reactive rare earth elements. It is used in the production of special optical glasses and to improve the malleability of steel. Additionally, lanthanum plays a significant role in wastewater treatment and oil refining processes. It has been nicknamed “super calcium” by scientists due to its application in photoconversion films, which enhance the efficiency of solar cells by converting ultraviolet light into visible light.

Related Product: Lanthanum Sputtering Target

NickelNickel is a chemical element whose name is derived from the German term ‘kupfernickel,’ meaning either “devil’s copper” or “St. Nicholas’s copper.” It was first mentioned and observed by F. Cronstedt in 1751, who also later accomplished and announced its isolation. The chemical symbol for nickel is “Ni,” and its atomic number is 28. Nickel is located in Period 4, Group 10 of the periodic table, within the d-block. Its relative atomic mass is 58.6934(2) Dalton, with the number in brackets indicating the measurement uncertainty. Nickel is widely used in alloys, particularly stainless steel, and is valued for its corrosion resistance and ability to withstand high temperatures.

Related Product: Nickel Sputtering Target

OxygenOxygen is a chemical element whose name is derived from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed by W. Scheele in 1771, who also later accomplished and announced its isolation. The chemical symbol for oxygen is “O,” and its atomic number is 8. Oxygen is located in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in brackets indicating the measurement uncertainty. Oxygen is essential for respiration in most life forms and plays a crucial role in combustion, oxidation, and various chemical processes.

Lanthanum Nickel Oxide Sputter Target Handling Notes

  • Indium Bonding: Indium bonding is recommended for the lanthanum nickel oxide sputtering target due to its brittleness and low thermal conductivity, which make it less suitable for traditional sputtering methods.
  • Thermal Conductivity: This material has low thermal conductivity and is susceptible to thermal shock. Proper handling and bonding techniques are essential to prevent damage during the sputtering process.

Lanthanum Nickel Oxide Sputter Target Application

The Lanthanum Nickel Oxide Sputtering Target is utilized in a variety of applications, including thin film deposition, decorative coatings, semiconductors, displays, LEDs, and photovoltaic devices. It is also important for functional coatings, the optical information storage industry, glass coatings for automotive and architectural glass, and optical communication systems, among other fields.

Lanthanum Nickel Oxide Sputter Target Packing

Our Lanthanum Nickel Oxide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. We take great care to prevent any damage during storage and transportation, maintaining the highest standards of product integrity upon delivery.

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TFM offers Lanthanum Nickel Oxide  Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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