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Lead Telluride Evaporation Materials

VD0863 Lead Telluride Evaporation Materials, PbTe

Catalog No.VD0863
MaterialLead Telluride (PbTe)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM is a prominent producer and provider of premium lead telluride evaporation materials, known for their high purity. In addition to lead telluride, we supply a broad range of evaporation materials suited for various applications. Our products are available in both powder and granule formats, with customization options offered to meet specific needs.

MSDS File

Lead Telluride Evaporation Materials Overview

Lead telluride evaporation materials, known chemically as PbTe, are vital for achieving high-quality deposition in various industrial processes. At TFM, our lead telluride is available with remarkable purity levels, up to 99.9995%, thanks to our rigorous quality assurance practices.

Specifications

Material TypeLead Telluride
SymbolPbTe
Appearance/ColorGray cubic crystals
Melting Point924 °C (1,695 °F; 1,197 K)
Density6.14 g/cm3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications

Lead telluride evaporation materials are used in various deposition techniques such as:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

These materials are also utilized in optics for:

  • Wear Protection
  • Decorative Coatings
  • Display Technologies

Packaging

Our lead telluride evaporation materials are securely packaged in plastic vacuum bags to prevent damage and preserve their quality during transit. Each package includes a Certificate of Analysis (COA) for the raw material.

Contact Us

TFM excels in producing high-purity lead telluride evaporation materials suitable for a range of advanced applications, including semiconductors, CVD, PVD, and optical coatings. Our expert teams in engineering, manufacturing, and analysis ensure the highest standards in our products. For more information or to place an inquiry, please contact us today.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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