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Lithium Lanthanum Zirconate Sputtering Target

ST0879 Lithium Lanthanum Zirconate Sputtering Target, LLZO

Chemical Formula: LLZO
Catalog Number: ST0879
Purity: 99.9% ~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

lithium lanthanum zirconate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Lanthanum Zirconate Sputtering Target Description

LithiumLithium lanthanum zirconate sputtering target is a silver material containing lithium (Li), lanthanum (La), zirconium (Zr), and oxygen (O). It is a conductive ceramic solid electrolyte used in lithium-ion batteries.

Lithium is a chemical element named from the Greek word ‘lithos,’ meaning stone. First identified in 1817 by A. Arfwedson and later isolated by W. T. Brande, it has the chemical symbol “Li.” Its atomic number is 3, and it is located in Period 2, Group 1 of the periodic table, belonging to the s-block. The relative atomic mass of lithium is 6.941(2) Dalton, with the number in brackets indicating the uncertainty.

Related: Lithium Sputtering Target

LanthanumLanthanum, symbol La and atomic number 57, is a soft, malleable, silvery-white metal. As one of the most reactive rare earth elements, lanthanum is used in special optical glasses and to enhance steel’s malleability. Additionally, it plays a role in wastewater treatment and oil refining. Due to its use in photoconversion films, lanthanum has been nicknamed “super calcium.”

Related: Lanthanum Sputtering Target

ZirconiumZirconium is a lustrous, grey-white transition metal known for its strength and resemblance to hafnium and, to a lesser extent, titanium. It is primarily used as a refractory and opacifier, with smaller amounts employed as an alloying agent due to its strong corrosion resistance. Zirconium forms various inorganic and organometallic compounds, such as zirconium dioxide and zirconocene dichloride. It has five natural isotopes, three of which are stable. Zirconium compounds do not have any known biological role.

Related: Zirconium Sputtering Target

Lithium Lanthanum Zirconate Sputtering Target Specification

Material TypeLithium Lanthanum Zirconate
SymbolLLZO
Color/AppearanceSilver Solid
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Lithium Lanthanum Zirconate Sputtering Target Packing

Our lithium lanthanum zirconate sputtering targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage or transportation.

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TFM offers lithium lanthanum zirconate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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