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ST0531 Lithium Tantalate Sputtering Target, LiTaO3

Chemical Formula: LiTaO3
Catalog Number: ST0531
CAS Number: 12031-66-2
Purity: 99.9% ~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

lithium tantalate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Tantalate Sputtering Target Description

LithiumLithium Tantalate (LiTaO₃) sputtering target is a silvery sputtering material composed of lithium (Li), tantalum (Ta), and oxygen (O). Lithium tantalate is known for its ferroelectric properties and is used in various applications, including lithium-ion batteries.

Lithium is a chemical element derived from the Greek word “lithos,” meaning stone. It was first identified in 1817 by A. Arfwedson, with its isolation later achieved and announced by W. T. Brande. The chemical symbol for lithium is “Li.” It holds the atomic number 3 in the periodic table, located in Period 2 and Group 1, within the s-block. The relative atomic mass of lithium is 6.941(2) Dalton, with the number in brackets indicating the uncertainty.

Related: Lithium Sputtering Target

Tantalum

Tantalum is a rare, hard, blue-gray, lustrous transition metal known for its exceptional corrosion resistance. It belongs to the group of refractory metals, which are commonly used as minor components in various alloys. Due to its chemical inertness, tantalum is highly valued for use in laboratory equipment and is often employed as a substitute for platinum.

Related: Tantalum Sputtering Target

Lithium Tantalate Sputtering Target Specification

Material TypeLithium Tantalate
SymbolLiTaO3
Color/AppearanceSilvery Solid
Molecular Weight235.89
Melting Point1,650 °C
Density7.46 g/cm3
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Lithium Tantalate Sputtering Target Applications

These applications highlight the versatility and importance of advanced materials:
  • Electrochromic Glass: Utilized in smart windows and displays, electrochromic glass can change its transparency or color when an electrical voltage is applied, offering energy-efficient solutions for controlling light and heat in buildings and vehicles.
  • Negative Electrode Materials for Li-Ion and Li-Batteries: Key components in lithium-ion batteries, these materials play a critical role in energy storage, providing the high energy density required for portable electronics, electric vehicles, and renewable energy systems.
  • Solid Electrolyte Material for Lithium Ions: Used in solid-state batteries, these materials enhance safety and energy density by replacing the liquid electrolyte, leading to more stable and efficient battery designs.
  • Pyroelectric and Ferroelectric Microelectronics: These materials are used in sensors, actuators, and memory devices, exploiting their unique electrical properties to create innovative microelectronic components.

Lithium Tantalate Sputtering Target Packing

Our lithium tantalate sputtering targets are clearly tagged and labeled externally for efficient identification and quality control. We take great care to prevent any damage during storage or transportation.

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TFM offers lithium tantalate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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