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Lithium Oxide Sputtering Targets

ST0533 Lithium Tetrachloroaluminate Sputtering Target, LiAlCl4

Chemical Formula: LiAlCl4
Catalog Number: ST0533
CAS Number: 14024-11-4
Purity: 99.9% ~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

lithium tetrachloroaluminate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Tetrachloroaluminate Sputtering Target Description

LithiumLithium tetrachloroaluminate sputtering target is a white sputtering material with the formula LiAlCl₄, used as a liquid cathode and electrolyte in some lithium batteries when dissolved in thionyl chloride.

Lithium, derived from the Greek word ‘lithos’ meaning stone, was first mentioned in 1817 by A. Arfwedson and later isolated by W. T. Brande. The chemical symbol for lithium is ‘Li,’ with an atomic number of 3, located in Period 2, Group 1 of the s-block in the periodic table. Its relative atomic mass is 6.941(2) Dalton, with the number in brackets indicating the uncertainty.

Related: Lithium Sputtering Target

Aluminum

Aluminum, also known as Aluminium, is a silvery-white, soft, non-magnetic, and ductile metal belonging to the boron group. It constitutes about 8% of the Earth’s crust by mass, making it the third most abundant element after oxygen and silicon, and the most abundant metal in the crust, although it is less common in the mantle below. The primary ore of aluminum is bauxite. Due to its high reactivity, native aluminum specimens are rare, occurring only in extreme reducing environments. Instead, aluminum is typically found combined in over 270 different minerals.

Related: Aluminum Sputtering Target

Lithium Tetrachloroaluminate Sputtering Target Specification

Material TypeLithium Tetrachloroaluminate
SymbolLiAlCl4
Color/AppearanceWhite Solid
Molecular Weight175.73
Melting Point143 °C
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Lithium Tetrachloroaluminate Sputtering Target Packing

Your lithium tetrachloroaluminate sputtering targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to prevent any damage during storage or transportation.

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TFM offers lithium tetrachloroaluminate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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