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Lithium Zinc Oxide Sputtering Target

ST0899 Lithium Zinc Oxide Sputtering Target, LZO

Catalog No.ST0899
Chemical FormulaLi:ZnO
CAS Number12024-21-4
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Lithium Zinc Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Zinc Oxide Sputtering Target Description

The Lithium Zinc Oxide Sputtering Target is a specialized material used in sputtering, a technique for thin film deposition in various fields, including electronics, optics, and coatings.

This sputtering target is composed of lithium zinc oxide (LiZnO), a compound of lithium (Li), zinc (Zn), and oxygen (O). It is typically manufactured as a high-purity, solid disc-shaped material.

In the sputtering process, a high-energy plasma is generated within a vacuum chamber. Ions in the plasma bombard the target, causing atoms from the lithium zinc oxide to be ejected. These sputtered atoms then deposit onto a substrate, forming a thin film coating.

Related Product: Lithium Sputtering Target, Indium Zinc Oxide Sputtering Target

Lithium Zinc Oxide Sputtering Target Specifications

Compound FormulaLi:ZnO
Molecular Weight88.33
AppearanceWhite Target
Density4.59 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Lithium Zinc Oxide Sputtering Target Handling Notes

Indium bonding is recommended for Lithium Zinc Oxide Sputtering Targets because of the material’s properties that can complicate sputtering, such as its brittleness and low thermal conductivity. The low thermal conductivity makes it prone to thermal shock, so indium bonding helps improve the target’s stability and performance during the sputtering process.

Lithium Zinc Oxide Sputtering Target Application

  • Solar Panels: Used as conductive layers in photovoltaic cells to improve efficiency.
  • Gas Sensors: Provides transparent, conductive layers for detecting and measuring gases.
  • Electrochromic Devices: Enables color change in devices such as smart windows and displays.
  • Photoelectrochemical Water Splitting: Facilitates water splitting for hydrogen production.
  • Anti-Reflection Coatings: Reduces glare and improves light transmission in optical devices.
  • Flexible Electronics: Provides conductivity in bendable and flexible electronic devices.

Lithium Zinc Oxide Sputtering Target Packaging

We meticulously handle our Lithium Zinc Oxide Sputtering Targets during storage and transportation to ensure that they retain their quality and remain in their original condition.

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TFM offers Lithium Zinc Oxide  Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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