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lutetiumiii-oxide

VD0713 Lutetium(III) Oxide Evaporation Materials, Lu2O3

Catalog No.VD0713
MaterialLutetium Oxide (Lu2O3)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) is a prominent manufacturer and supplier of high-purity lutetium(III) oxide (Lu₂O₃) evaporation materials. Available in both powder and granule forms, our materials can also be customized to meet specific needs. Our commitment to quality ensures that our lutetium(III) oxide materials support superior performance in a range of deposition applications.

MSDS File

Lutetium(III) Oxide Evaporation Materials Description

Thin-Film Mat Engineering (TFM) offers high-purity lutetium(III) oxide (Lu₂O₃) evaporation materials, essential for achieving exceptional film quality in various deposition processes. Our lutetium(III) oxide is available with purity levels reaching up to 99.9995%, thanks to our stringent quality assurance practices.

Related Products: Lutetium Evaporation Materials

Specifications

Material TypeLutetium(III) Oxide
SymbolLu2O3
Appearance/ColorWhite Solid
Melting Point2,490 °C
Purity99.5% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications

Our lutetium(III) oxide evaporation materials are utilized in:

  • Deposition Processes: Including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Ideal for wear protection, decorative coatings, and display technologies.

Packaging and Handling

Lutetium(III) oxide materials are meticulously tagged and labeled to ensure efficient identification and quality control. We prioritize careful handling to prevent any damage during storage and transportation.

Contact Us

Thin-Film Mat Engineering (TFM) provides high-purity lutetium(III) oxide materials in various forms such as tablets, granules, rods, and wires. Customized forms and quantities are available upon request. Additionally, we offer evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and further inquiries, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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