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magnesium-silicide

VD0802 Magnesium Silicide Evaporation Materials, Mg2Si

Catalog No.VD0802
MaterialMagnesium Silicide (Mg2Si)
Purity99.9%
ShapePowder/ Granule/ Custom-made

At TFM, we specialize in producing and supplying premium-grade magnesium silicide evaporation materials, among other diverse evaporation products. Our offerings include both powder and granule forms, with the added option for custom configurations tailored to your specific needs.

MSDS File

Magnesium Silicide Evaporation Materials Overview

At TFM, our magnesium silicide evaporation materials feature the chemical composition Mg2Si, known for its role in high-quality deposition processes. Our high-purity Mg2Si materials, with purity levels reaching up to 99.9995%, are crucial for achieving superior film quality. We employ rigorous quality assurance procedures to ensure the reliability of our products.

Related Products: Magnesium Evaporation Materials, Silicide Ceramic Evaporation Materials

Magnesium Silicide Evaporation Materials Specifications

Material TypeMagnesium silicide
SymbolMg2Si
Appearance/ColorGray cubic crystals
Melting Point1,102 °C (2,016 °F; 1,375 K)
Density1.99 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications of Magnesium Silicide Evaporation Materials

Our magnesium silicide materials are essential in various deposition processes, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are primarily used in optics for wear protection, decorative coatings, and display technologies.

Packaging and Handling

Magnesium silicide evaporation materials are carefully tagged and labeled to facilitate efficient identification and quality control. We ensure that the materials are protected against damage during storage and transportation.

Contact Us

TFM is a premier provider of high-purity magnesium silicide evaporation materials, available in various forms such as tablets, granules, rods, and wires. We also offer customized shapes and quantities. In addition to evaporation materials, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For inquiries about pricing and additional products, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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