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ST0916 Manganese Dioxide Sputtering Target, MnO2

Chemical FormulaMnO2
Catalog No.ST0916
CAS NumberN/A
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Manganese Dioxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Manganese Dioxide Sputtering Target Description

Manganese Dioxide Sputtering Target is a specialized material used in sputter deposition, a technique essential for thin-film manufacturing and coating applications.

Manganese dioxide is valued for its versatility and is employed in various fields, including batteries, catalysts, and other technological applications. Utilizing a sputtering target made of manganese dioxide enables the precise customization and fine-tuning of thin films, allowing for the development of materials with specific properties tailored to diverse technological needs.

Related Product: Manganese Oxide Sputtering Target

Manganese Dioxide Sputtering Target Specifications

Compound FormulaMnO2
Molecular Weight86.94
AppearanceBlack Target
Melting Point>1000℃
Density–
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Manganese Dioxide Sputtering Target Handling Notes

Indium bonding is recommended for the Manganese Dioxide Sputtering Target due to its inherent characteristics, such as brittleness and low thermal conductivity, which can affect the sputtering process. Manganese dioxide’s low thermal conductivity and susceptibility to thermal shock necessitate the use of indium bonding to enhance the stability and performance of the sputtering target during operation.

Manganese Dioxide Sputtering Target Application

The Manganese Dioxide Sputtering Target has diverse applications across multiple industries, including electronics, optics, and sensors. Its ability to produce thin films with specific properties makes it valuable for use in these fields and more.

Manganese Dioxide Sputtering Target Packaging

Our Manganese Dioxide Sputtering Targets are meticulously handled during storage and transportation to ensure that they remain in optimal condition and maintain their quality.

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TFM offers Manganese Dioxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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