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ST0297 Molybdenum Boride Sputtering Target, Mo2B5

Chemical Formula:Ā Mo2B5
Catalog Number:Ā ST0297
CAS Number:Ā 12007-97-5
Purity:Ā >99.5%
Shape:Ā Discs, Plates, Column Targets, Step Targets, Custom-made

Molybdenum BorideĀ  sputtering targetĀ  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Molybdenum Boride Sputtering Target Description

A Molybdenum Boride Sputtering Target is a ceramic material composed of molybdenum and boron, used in sputtering processes. This target is commonly utilized in thin film deposition and various specialized applications due to its unique properties and the combination of molybdenum and boron.

MolybdenumMolybdenum is a chemical element with the symbol “Mo” and an atomic number of 42. The name “molybdenum” comes from the Greek word ‘molybdos,’ meaning lead. It was first identified in 1778 by Carl Wilhelm Scheele, with the isolation of the element later achieved and announced by Peter Jacob Hjelm. Molybdenum is situated in Period 5 and Group 6 of the periodic table, classified as a d-block element. Its relative atomic mass is approximately 95.94 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product:Ā Molybdenum Sputtering Target

BoronBoron, represented by the symbol “B” and atomic number 5, derives its name from the Arabic word ‘buraq,’ referring to borax. It was first identified in 1808 by scientists Louis-Joseph Gay-Lussac and Louis-Jacques ThĆ©nard, with its isolation later achieved and announced by Sir Humphry Davy. Boron is located in Period 2 and Group 13 of the periodic table, classified within the p-block elements. Its relative atomic mass is approximately 10.811 Daltons, with the number in parentheses indicating a margin of uncertainty.

Molybdenum Boride Sputtering Target Specification

Compound FormulaMo2B5
AppearanceGray Solid
Density9.20 g/cm3
Melting Point2,000 Ā°C
Available SizesDia.: 1.0ā€³, 2.0ā€³, 3.0ā€³, 4.0ā€³, 5.0ā€³, 6.0ā€³
Thick: 0.125ā€³, 0.250ā€³

Molybdenum Boride Sputtering Target Application

The Molybdenum Boride Sputtering Target is utilized in a variety of applications, including thin film deposition and decorative coatings. It is commonly used in the semiconductor industry, display technologies, and the production of LEDs and photovoltaic devices. Additionally, this material plays a significant role in functional coatings, the optical information storage industry, glass coating applications for automotive and architectural glass, and optical communication technologies.

Molybdenum Boride Sputtering TargetĀ Packing

Our Molybdenum Boride Sputtering Targets are carefully tagged and labeled on the exterior to facilitate easy identification and maintain stringent quality control. We take great care in handling these targets to prevent any potential damage during storage and transportation, ensuring they arrive in excellent condition.

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TFM offers Molybdenum Boride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

Itā€™s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Alā‚‚Oā‚ƒ, SiOā‚‚, TiOā‚‚), alloys, or compositesā€”chosen based on the filmā€™s desired properties.

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They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

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In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

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Key factors include the targetā€™s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

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Operators monitor target erosion (often by measuring the depth of the eroded ā€œrace trackā€) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

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Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

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DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the targetā€™s surface.

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In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also ā€œpoisonā€ the target surface if not carefully controlled.

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Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

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Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

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