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ST0297 Molybdenum Boride Sputtering Target, Mo2B5

Chemical Formula:Ā Mo2B5
Catalog Number:Ā ST0297
CAS Number:Ā 12007-97-5
Purity:Ā >99.5%
Shape:Ā Discs, Plates, Column Targets, Step Targets, Custom-made

Molybdenum BorideĀ  sputtering targetĀ  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Molybdenum Boride Sputtering Target (Moā‚‚Bā‚…)

Introduction

Molybdenum Boride (Moā‚‚Bā‚…) Sputtering Target is a high-hardness boride ceramic material developed for advanced protective and functional thin film applications. Known for its excellent wear resistance, high melting point, and chemical stability, Moā‚‚Bā‚… is widely explored in hard coatings, diffusion barriers, and high-temperature surface engineering. As a sputtering target, Moā‚‚Bā‚… enables deposition of dense boride-based thin films suitable for demanding mechanical and thermal environments.

Detailed Description

Our Moā‚‚Bā‚… Sputtering Targets are manufactured from high-purity molybdenum and boron sources using carefully controlled synthesis and sintering processes to ensure phase purity and compositional uniformity. Precise Mo:B ratio control is essential to maintain the desired boride structure, which directly influences hardness, oxidation resistance, and film adhesion.

The targets are consolidated to achieve high density and uniform microstructure, minimizing porosity and reducing particle generation during sputtering. Stable plasma conditions are achieved through optimized grain structure and surface finishing. Depending on system configuration, Moā‚‚Bā‚… can be deposited using RF sputtering systems, and in some cases DC sputtering may be applicable due to partial electrical conductivity.

Targets are available in standard circular or rectangular planar formats and can be supplied unbonded or bonded to copper backing plates for improved thermal management in higher-power applications.

Applications

Molybdenum Boride (Moā‚‚Bā‚…) Sputtering Targets are widely used in:

  • Hard and wear-resistant protective coatings

  • High-temperature surface engineering

  • Diffusion barrier and interlayer films

  • Tooling and mechanical component coatings

  • Boride-based functional thin films

  • Research on ultra-hard and refractory materials

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionMoā‚‚Bā‚…Determines hardness and stability
Purity99.5% ā€“ 99.9%Minimizes impurity-induced defects
Diameter25 ā€“ 200 mm (custom available)Compatible with sputtering systems
Thickness3 ā€“ 6 mmInfluences target lifetime
Densityā‰„ 95% theoreticalImproves plasma stability
Sputtering ModeRF / DC (system dependent)Suitable for boride materials
BondingUnbonded / Cu backing (optional)Enhances heat dissipation

Comparison with Related Boride Materials

MaterialKey AdvantageTypical Application
Moā‚‚Bā‚…High hardness & chemical stabilityProtective coatings
TiBā‚‚Excellent conductivity & hardnessCutting tools & wear layers
ZrBā‚‚Ultra-high-temperature capabilityThermal protection
HfBā‚‚Extreme oxidation resistanceAerospace coatings

FAQ

QuestionAnswer
Is Moā‚‚Bā‚… suitable for hard coatings?Yes, it is widely studied for wear-resistant thin films.
Can the target size be customized?Yes, diameter, thickness, and bonding options are available.
Which sputtering mode is recommended?RF sputtering is commonly used; DC may be possible depending on conductivity.
How is the target packaged?Vacuum-sealed with protective foam and export-grade cartons or crates.

Packaging

Our Molybdenum Boride (Moā‚‚Bā‚…) Sputtering Targets are meticulously labeled and vacuum-sealed to prevent contamination and moisture exposure. Export-grade packaging ensures safe transportation and storage stability.

Conclusion

Molybdenum Boride (Moā‚‚Bā‚…) Sputtering Target provides a dependable solution for depositing ultra-hard, chemically stable boride thin films. With controlled composition, high density, and customizable configurations, it is well suited for protective coatings, high-temperature applications, and advanced materials research.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com

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FAQ

Itā€™s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Alā‚‚Oā‚ƒ, SiOā‚‚, TiOā‚‚), alloys, or compositesā€”chosen based on the filmā€™s desired properties.

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They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

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In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

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Key factors include the targetā€™s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

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Operators monitor target erosion (often by measuring the depth of the eroded ā€œrace trackā€) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

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Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

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DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the targetā€™s surface.

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In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also ā€œpoisonā€ the target surface if not carefully controlled.

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Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

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Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

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