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ST0030 Molybdenum Sputtering Target, Mo

Chemical Formula: Mo
Catalog Number: ST0030
CAS Number: 7439-98-7
Purity: >99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Molybdenum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Molybdenum Sputtering Target Description

Molybdenum
Element – Molybdenum

Molybdenum sputtering targets possess the same characteristics as their source materials, whether pure molybdenum or molybdenum alloys. Molybdenum is a silvery-white, extremely hard metal with a melting point of 2623°C (4753°F), making it one of the highest melting points among natural elements, surpassed only by tantalum, osmium, rhenium, and tungsten. Additionally, molybdenum has one of the lowest thermal expansion coefficients among commercially used metals.

Molybdenum targets boast nearly 100% density, enhancing the conductivity of the layers they create. SAM is renowned for producing high-purity sputtering target materials with maximum density and minimal grain size, ideal for PVD, CVD, APS, and VPS coating processes. This results in faster processing due to increased sputtering speeds.

Molybdenum Sputtering Target Specification

Material Type Molybdenum
Symbol Mo
Color/Appearance Grey, Metallic
Melting Point  2,617 °C
Sputter DC
Type of Bond Indium, Elastomer
Comments Films smooth, hard. Careful degas required.
Density 10280 kg/m3
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Molybdenum Sputtering Target Applications

High-performance molybdenum sputtering materials are essential for various thin-film coating applications. They are widely used in industries such as CD-ROM production, decorative coatings, flat panel displays, and functional coatings. These materials also play a crucial role in optical information storage, the glass coating industry—including automotive and architectural glass—and optical communications.

Planar and Rotary Molybdenum Sputtering Target

Our planar molybdenum sputtering targets are characterized by their high purity, density, and uniform microstructure, making them ideal for thin film deposition in TFT displays and related industries. We offer both single and multi-piece molybdenum planar targets to meet diverse application needs.

Additionally, our rotary molybdenum sputtering targets feature a high utilization rate exceeding 75%, ensuring efficient use of target materials and maximizing your investment.

Molybdenum Sputtering Target Bonding Services

Specialized bonding services for Molybdenum Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Packaging

Our molybdenum sputter targets are meticulously handled to ensure they remain undamaged during storage and transportation. This careful handling preserves the high quality of our products, maintaining them in their original condition until they reach you.

Get Contact

TFM offers Molybdenum Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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