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Neodymium Copper Oxide Sputtering Target

ST0459 Neodymium Copper Oxide Sputtering Target, Nd2CuO4

Chemical Formula: Nd2CuO4
Catalog Number: ST0459
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Neodymium Copper Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Neodymium Copper Oxide Sputtering Target Description

The Neodymium Copper Oxide Sputtering Target is composed of neodymium, copper, and oxygen. High-purity neodymium copper oxide sputter targets are crucial in deposition processes, ensuring high-quality deposited films. Trusted for their reliability, TFM specializes in producing sputtering targets with purities up to 99.9995%, using rigorous quality assurance processes.

Related products: Neodymium Sputtering Target, Copper Sputtering Target

Neodymium

CopperOxygen

Neodymium Copper Oxide Sputtering Target Specification

Material Type Neodymium Copper Oxide
Symbol Nd2CuO4
Color/Appearance Solid
Melting Point N/A
Density N/A
Type of Bond Elastomer, Indium
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Neodymium Copper Oxide Sputtering Target Application

The Neodymium Copper Oxide Sputtering Target is employed in various applications, including thin film deposition, decoration, semiconductors, displays, LEDs, and photovoltaic devices. It is also used for functional coatings, optical information storage, glass coatings in industries such as automotive and architectural glass, and optical communication.

Neodymium Copper Oxide Sputtering Target Bonding Services

Specialized bonding services for Neodymium Copper Oxide Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Neodymium Copper Oxide Sputtering Target Packaging

Our Neodymium Copper Oxide Sputter Targets are meticulously handled to prevent any damage during storage and transportation, ensuring that the quality of our products remains in pristine condition.

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TFM offers Neodymium Copper Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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