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VD0565 Nickel Evaporation Materials, Ni

Material Type: Nickel
Symbol: Ni
Purity: 99.9% ~ 99.99%
Shape: Powder/ Granule/ Custom-made

TFM stands as a leading manufacturer and supplier of high-purity nickel evaporation materials, as well as a broad selection of other evaporation materials. We provide these materials in both powder and granule form, with the option for customization based on your specific requirements.

MSDS File

Nickel Evaporation Material Description

Nickel is a silvery-white, hard, and ductile metal valued for its excellent polish and corrosion resistance. With a density of 8.91 g/cc, a melting point of 1,453°C, and a vapor pressure of 10^-4 Torr at 1,262°C, nickel is known for its malleability, ductility, and ferromagnetic properties. It resists tarnishing in air and is the second most prevalent element in the Earth’s core after iron. While nickel is widely used in producing stainless steel, coins, and batteries, its use in jewelry has declined due to potential skin allergies.

In deposition processes, high-purity nickel evaporation materials are crucial for producing high-quality deposited films. TFM specializes in crafting nickel evaporation materials with purities reaching up to 99.99%, ensuring product reliability through rigorous quality control measures.

nickel evaporation materials

Nickel Evaporation Material Specification

Material TypeNickel
SymbolNi
Color/AppearanceLustrous silvery metal
Melting Point1455 °C
Density8.902 g/cm3
Thermal Conductivity90.9 W·m-1·K-1  (25°C)
Electrical Resistivity69.3 nΩ·m (20 °C)
FerromagneticMagnetic Material
SynonymsNi Pellets, Ni Pieces, Ni Evaporation Pellet, Nickel Pellets, Nickel Pieces, Nickel Evaporation Pellet

Nickel Evaporation Material Application

Nickel evaporation materials are widely used in various deposition processes, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).

In optics, they serve key roles in applications like wear protection, decorative coatings, and display technologies.

Nickel Evaporation Material Packaging

We take great care in handling our nickel evaporation materials to prevent any damage during storage and transportation. This careful management ensures that the quality of our products remains uncompromised, arriving in their original, pristine condition.

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TFM offers a wide range of nickel evaporation materials, available in different forms, purities, sizes, and prices to meet diverse needs. Our specialty lies in producing high-purity e-beam evaporation materials, characterized by the highest density and the smallest average grain sizes. For the latest pricing on our evaporation pellets and other deposition materials not listed, please reach out to us with your inquiry.

Ordering Table

Material Size Quantity Purity Part Number
Nickel 1/4" Dia. x 1/2" Length 1 lb. 99.98% EVMNI38QXH
Nickel 1/4" Dia. x 1/2" Length 1 lb. 99.995% EVMNI45QXH
Nickel 1/4" Dia. x 1/2" Length 100 g 99.995% EVMNI45QXHD
Nickel 1/4" Dia. x 1/4" Length 1 lb. 99.995% EVMNI45QXQ
Nickel 1/4" Dia. x 1/4" Length 25 g 99.995% EVMNI45QXQA
Nickel 1/4" Dia. x 1/4" Length 50 g 99.995% EVMNI45QXQB
Nickel 1/4" Dia. x 1/4" Length 100 g 99.995% EVMNI45QXQD
Nickel 1/4" Dia. x 1/4" Length 225 g 99.995% EVMNI45QXQI
Nickel 1/4" Dia. x 1/4" Length 250 g 99.995% EVMNI45QXQJ
Nickel 1/8" Dia. x 1/4" Length 1 lb. 99.995% EVMNI45EXQ
Nickel 1/8" Dia. x 1/8" Length 1 lb. 99.98% EVMNI38EXE
Nickel 1/8" Dia. x 1/8" Length 25 g 99.98% EVMNI38EXEA
Nickel 1/8" Dia. x 1/8" Length 50 g 99.98% EVMNI38EXEB
Nickel 1/8" Dia. x 1/8" Length 100 g 99.98% EVMNI38EXED
Nickel 1/8" Dia. x 1/8" Length 1 lb. 99.995% EVMNI45EXE
Nickel 1/8" Dia. x 1/8" Length 25 g 99.995% EVMNI45EXEA
Nickel 1/8" Dia. x 1/8" Length 50 g 99.995% EVMNI45EXEB
Nickel 1/8" Dia. x 1/8" Length 100 g 99.995% EVMNI45EXED
Nickel 1/8" Dia. x 1/8" Length 250 g 99.995% EVMNI45EXEJ
Nickel 1/8" Dia. x 1/8" Length 500 g 99.995% EVMNI45EXET

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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