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ST0999 Nickel Iron Sputtering Target, Ni-Fe

Chemical FormulaNi-Fe
Catalog No.ST0999
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

TFM proudly utilizes extensive materials science expertise to offer competitively priced, exceptionally pure Nickel Iron Sputtering Targets. Committed to excellence, we deliver top-quality targets that meet rigorous standards in nanotechnology and thin-film deposition.

MSDS File

Nickel Iron Sputtering Target Description

Nickel Iron Sputtering Targets possess notable properties essential for diverse applications. Renowned for their exceptional purity, these targets play a vital role in precise thin-film deposition processes. The Nickel Iron composition ensures desirable magnetic and electrical properties, making them valuable for applications in electronics, magnetics, and sensor technologies. With excellent corrosion resistance, these targets contribute to the production of durable and reliable coatings. Overall, the distinctive properties of Nickel Iron Sputtering Targets make them integral in advancing various technological fields.

Related Product: Aluminum Nickel Sputtering Target, Chromium Nickel Sputtering Target

Nickel Iron Sputtering Target Specifications

Compound FormulaNi-Fe
AppearanceSilver Grey Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Nickel Iron Sputtering Target Handling Notes

Indium bonding is recommended for the Nickel Iron Sputtering Target due to characteristics that make it challenging for sputtering, such as brittleness and low thermal conductivity. Its low thermal conductivity and susceptibility to thermal shock further highlight the need for appropriate bonding to ensure effective performance during sputtering.

Nickel Iron Sputtering Target Application

Nickel Iron Sputtering Targets are highly versatile and integral to advanced technologies. Used primarily in thin-film deposition, these targets are essential for electronics, magnetics, and sensor technologies. The exceptional purity of Nickel Iron ensures precise and efficient coating, which is critical for producing high-performance electronic devices and sensors. Their distinctive magnetic and electrical properties aid in developing efficient components like magnetic storage devices. Additionally, their excellent corrosion resistance makes them ideal for creating durable and reliable coatings. As such, Nickel Iron Sputtering Targets are crucial materials for advancing various technological applications.

Nickel Iron Sputtering Target Packaging

We handle our Nickel Iron Sputtering Target with great care during storage and transportation to ensure it maintains its original quality and condition.

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TFM provides Nickel Iron Sputtering Targets in a variety of forms, purities, and sizes. We specialize in producing high-purity physical vapor deposition (PVD) materials with maximum density and minimal average grain sizes, suitable for semiconductor applications, chemical vapor deposition (CVD), and PVD processes for display and optical technologies.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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