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Niobium Carbide Evaporation Materials

VD0765 Niobium Carbide Evaporation Materials, NbC

Catalog No.VD0765
MaterialNiobium Carbide (NbC)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier manufacturer and supplier of high-purity niobium carbide and a diverse range of evaporation materials. Our offerings include both powder and granule forms of evaporation materials. For specialized needs, we also provide customized forms tailored to specific requirements.

MSDS File

Niobium Carbide Evaporation Materials

Introduction

Niobium Carbide (NbC) Evaporation Materials are widely used in thin film deposition processes where high hardness, thermal stability, and wear resistance are required. Owing to its unique combination of refractory properties and electrical conductivity, NbC is a preferred material for creating protective, conductive, and functional coatings in advanced engineering and research applications.

Detailed Description

Niobium Carbide evaporation materials are typically supplied as high-purity pellets, pieces, or granules, optimized for electron beam (e-beam) and thermal evaporation systems. With a purity level of ≥99.9%, they ensure minimal contamination during deposition, providing films with consistent composition and performance.

Key features include:

  • High Melting Point (3500 °C) – ensures stability in high-temperature evaporation.

  • Hardness & Wear Resistance – suitable for protective coatings in demanding environments.

  • Good Electrical Conductivity – enables functional coatings for microelectronics and conductive films.

  • Chemical Inertness – resists oxidation and corrosion under controlled vacuum deposition.

  • Customizable Forms – available in pellets, tablets, or irregular pieces to match evaporation setups.

Applications

Niobium Carbide evaporation materials are used in a wide range of industries:

  • Semiconductors & Microelectronics – conductive films, diffusion barriers, and protective layers.

  • Cutting Tools & Wear-Resistant Coatings – thin films for hardness enhancement.

  • Aerospace & Energy – high-temperature and oxidation-resistant coatings.

  • Decorative Coatings – metallic-gray finish with excellent durability.

  • Material Science R&D – studies on refractory carbides and functional thin films.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% (3N)Ensures low contamination
FormPellets, pieces, granulesMatches evaporation requirements
Particle Size3 – 12 mm (customizable)Adapts to crucible/e-beam setups
Melting Point~3500 °CEnables high-temp thin films
Density7.82 g/cm³Contributes to stable evaporation rate

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Niobium CarbideHigh hardness, thermal stabilityProtective & conductive coatings
Titanium CarbideExcellent wear resistance, cost-effectiveCutting tools, decorative films
Tantalum CarbideExtreme thermal stabilityAerospace, ultra-high-temp films

FAQ

QuestionAnswer
What forms are available?Pellets, tablets, granules, and custom-shaped pieces.
Can NbC be evaporated in standard e-beam systems?Yes, it is suitable for both e-beam and thermal evaporation.
What industries benefit most from NbC films?Electronics, aerospace, energy, cutting tools, and coating industries.
How is it packaged?Vacuum-sealed with moisture protection, shipped in sturdy cartons or wooden crates.
Can the material be customized?Yes, purity, size, and form can be tailored to specific deposition setups.

Packaging

Niobium Carbide evaporation materials are carefully vacuum-sealed and moisture-protected before shipping. Each package is labeled for traceability and secured with foam inserts inside export-safe cartons or wooden crates to ensure safe transportation and storage.

Conclusion

Niobium Carbide Evaporation Materials provide exceptional performance for high-temperature, wear-resistant, and conductive thin film applications. With high purity, excellent stability, and customizable options, NbC is a reliable choice for both industrial and research-based thin film deposition.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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