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VD0765 Niobium Carbide Evaporation Materials, NbC

Catalog No.VD0765
MaterialNiobium Carbide (NbC)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier manufacturer and supplier of high-purity niobium carbide and a diverse range of evaporation materials. Our offerings include both powder and granule forms of evaporation materials. For specialized needs, we also provide customized forms tailored to specific requirements.

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Niobium Carbide Evaporation Materials Overview

Niobium carbide (NbC) is a carbide ceramic with exceptional properties used in various deposition processes. TFM excels in providing high-purity niobium carbide evaporation materials, crucial for ensuring superior film quality in deposition applications. Our materials boast a purity level of up to 99.9995%, a testament to our rigorous quality assurance procedures.

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Niobium Carbide Evaporation Materials Specification

Material TypeNiobium Carbide
SymbolNbC
Appearance/ColorBrown-gray Solid
Melting Point3,608 °C (6,526 °F; 3,881 K)
Density7.820 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications of Niobium Carbide Evaporation Materials

Niobium carbide evaporation materials are integral to:

  • Deposition Processes: Utilized in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Employed for wear protection, decorative coatings, and displays.

Packaging and Handling

Our niobium carbide evaporation materials are meticulously tagged and labeled for clear identification and quality control. We prioritize careful packaging to prevent any damage during storage and transportation.

Contact Us

TFM is your go-to source for high-purity niobium carbide evaporation materials, available in various forms including tablets, granules, rods, and wires. We also offer custom shapes and quantities upon request. Additionally, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and additional inquiries, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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